Frontiers of Mechanical Engineering >

0 184 - 191

DOI: https://doi.org/10.1007/s11465-009-0034-9

RESEARCH ARTICLE

Research and application of visual location technology for solder paste printing based on machine vision

  • Luosi WEI ,
  • Zongxia JIAO
Expand
  • School of Automation Science and Electrical Engineering, Beihang University, Beijing 100191, China

Received date: 10 Sep 2008

Accepted date: 10 Dec 2008

Published date: 05 Jun 2009

Copyright

2014 Higher Education Press and Springer-Verlag Berlin Heidelberg
Fold

Abstract

A location system is very important for solder paste printing in the process of surface mount technology (SMT). Using machine vision technology to complete the location mission is new and very efficient. This paper presents an integrated visual location system for solder paste printing based on machine vision. The working principle of solder paste printing is introduced and then the design and implementation of the visual location system are described. In the system, two key techniques are completed by secondary development based on VisionPro. One is accurate image location solved by the pattern-based location algorithms of PatMax. The other one is camera calibration that is achieved by image warping technology through the checkerboard plate. Moreover, the system can provide good performances such as high image locating accuracy with 1/40 sub-pixels, high anti-jamming, and high-speed location of objects whose appearance is rotated, scaled, and/or stretched.

Key words： machine vision; visual location; solder paste printing; VisionPro

Cite this article

Luosi WEI , Zongxia JIAO . Research and application of visual location technology for solder paste printing based on machine vision[J]. Frontiers of Mechanical Engineering, 0 , 4(2) : 184 -191 . DOI: 10.1007/s11465-009-0034-9

References

Publishing order | Descend order by publishing year | Descend order by cited within
1
Xian F. Developing trend of surface mount technology. Print and Mount, 2001, 6: 55

2
Wu Z, Zhou D. Surface Mount Technology Foundation. Beijing: Publishing House of Defence Industry, 2002

3
Zhang W. Applied Surface Mount Technology. Beijing: Publishing House of Electronics Industry, 2006, 5-240

4
An B, Xu Z, Chen H, Wu F, Wu Y. Solder paste printability tester and method. ICEPT'06.7th International Conference on Electronics Packaging Technology, 2006: 1-4

5
Clouthier R S. The complete solder paste printing processes. Surf Mount Technol, 1999, 13(1) : 6-8

6
Peck D J. Solder paste in SMT: a training perspective. Electro 98. Professional Program Proceedings, 1998: 1-14

7
Wei M, JiY. Surface Mount Technology and Its Application. Beijing: Publishin House of Machine Building, 2007, 136

8
Nguty T A, Budiman S, Rajkumar D, Solomon R, Ekere N N. Understanding the process window for printing lead-free solder pastes. IEEE Transactions on Electronics Packaging Manufacturing, 2001, 24(4): 249-254

DOI

9
Zhang P, Zhu Z. Machine vision technoloty and its application to automation of mechanical manufacture. Jouranal of Heifei University of Technology, 2007, 30(10): 1292-1293in Chinese

10
Xu J, Zhou D, Lam D C K. The vision processing system of the placement machine based on the pc platform machine vidion. Detect and Control Technology, 2007,26(7): 81-83

11
Cognex, MVS-8100D and CDC Cameras Hardware Manual, 2006

12
Cognex, http://www.cognex-china.com, 2007

13
Cognex,VisionPro.netHelp, 2006

Options
Outlines

/

〈 〉