Research and application of visual location technology for solder paste printing based on machine vision

Abstract

A location system is very important for solder paste printing in the process of surface mount technology (SMT). Using machine vision technology to complete the location mission is new and very efficient. This paper presents an integrated visual location system for solder paste printing based on machine vision. The working principle of solder paste printing is introduced and then the design and implementation of the visual location system are described. In the system, two key techniques are completed by secondary development based on VisionPro. One is accurate image location solved by the pattern-based location algorithms of PatMax. The other one is camera calibration that is achieved by image warping technology through the checkerboard plate. Moreover, the system can provide good performances such as high image locating accuracy with 1/40 sub-pixels, high anti-jamming, and high-speed location of objects whose appearance is rotated, scaled, and/or stretched.

Keywords

machine vision / visual location / solder paste printing / VisionPro

References

[1] Xian F. Developing trend of surface mount technology. Print and Mount, 2001, 6: 55

[2] Wu Z, Zhou D. Surface Mount Technology Foundation. Beijing: Publishing House of Defence Industry, 2002

[3] Zhang W. Applied Surface Mount Technology. Beijing: Publishing House of Electronics Industry, 2006, 5-240

[4] An B, Xu Z, Chen H, Wu F, Wu Y. Solder paste printability tester and method. ICEPT'06.7th International Conference on Electronics Packaging Technology, 2006: 1-4

[5] Clouthier R S. The complete solder paste printing processes. Surf Mount Technol, 1999, 13(1) : 6-8

[6] Peck D J. Solder paste in SMT: a training perspective. Electro 98. Professional Program Proceedings, 1998: 1-14

[7] Wei M, JiY. Surface Mount Technology and Its Application. Beijing: Publishin House of Machine Building, 2007, 136

[8] Nguty T A, Budiman S, Rajkumar D, Solomon R, Ekere N N. Understanding the process window for printing lead-free solder pastes. IEEE Transactions on Electronics Packaging Manufacturing, 2001, 24(4): 249-254

[9] Zhang P, Zhu Z. Machine vision technoloty and its application to automation of mechanical manufacture. Jouranal of Heifei University of Technology, 2007, 30(10): 1292-1293in Chinese

[10] Xu J, Zhou D, Lam D C K. The vision processing system of the placement machine based on the pc platform machine vidion. Detect and Control Technology, 2007,26(7): 81-83

[11] Cognex, MVS-8100D and CDC Cameras Hardware Manual, 2006

[12] Cognex, http://www.cognex-china.com, 2007

[13] Cognex,VisionPro.netHelp, 2006

RIGHTS & PERMISSIONS

2014 Higher Education Press and Springer-Verlag Berlin Heidelberg