RESEARCH ARTICLE

Patterned wafer bonding using ultraviolet adhesive

  • Rui ZHUO ,
  • Guanglan LIAO ,
  • Wenliang LIU ,
  • Lei NIE ,
  • Tielin SHI
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  • State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China

Received date: 26 Aug 2010

Accepted date: 08 Oct 2010

Published date: 05 Jun 2011

Copyright

2014 Higher Education Press and Springer-Verlag Berlin Heidelberg

Abstract

The process of patterned wafer bonding using ultraviolet (UV) adhesive as the intermediate layer was studied. By presetting the UV adhesive guide-layer, controlling the thickness of the intermediate layer (1– 1.5 μm), appropriate pre-drying temperature (60°C), and predrying time (6 min), we obtained the intermediate layer bonding of patterned quartz/quartz. Experimental results indicate that patterned wafer bonding using UV adhesive is achieved under room temperature. The process also has advantages of easy operation, low cost, and no plugging or leakage in the patterned area after bonding. Using the process, a microfluidic chip for red blood cell counting was designed and fabricated. Patterned wafer bonding using UV adhesive will have great potential in the fabrication of microfluidic chips.

Cite this article

Rui ZHUO , Guanglan LIAO , Wenliang LIU , Lei NIE , Tielin SHI . Patterned wafer bonding using ultraviolet adhesive[J]. Frontiers of Mechanical Engineering, 2011 , 6(2) : 214 -218 . DOI: 10.1007/s11465-011-0130-5

Acknowledgments

This study was supported by the National Key Basic Research Special Fund of China (No. 2009CB724204) and the the National Natural Science Foundation of China (Grant Nos. 50805061 and 50975106).
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