Patterned wafer bonding using ultraviolet adhesive

Abstract

The process of patterned wafer bonding using ultraviolet (UV) adhesive as the intermediate layer was studied. By presetting the UV adhesive guide-layer, controlling the thickness of the intermediate layer (1– 1.5 μm), appropriate pre-drying temperature (60°C), and predrying time (6 min), we obtained the intermediate layer bonding of patterned quartz/quartz. Experimental results indicate that patterned wafer bonding using UV adhesive is achieved under room temperature. The process also has advantages of easy operation, low cost, and no plugging or leakage in the patterned area after bonding. Using the process, a microfluidic chip for red blood cell counting was designed and fabricated. Patterned wafer bonding using UV adhesive will have great potential in the fabrication of microfluidic chips.

Keywords

ultraviolet (UV) adhesive / intermediate layer / patterned wafer bonding

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Acknowledgments

This study was supported by the National Key Basic Research Special Fund of China (No. 2009CB724204) and the the National Natural Science Foundation of China (Grant Nos. 50805061 and 50975106).

RIGHTS & PERMISSIONS

2014 Higher Education Press and Springer-Verlag Berlin Heidelberg