Laser polishing of a high-entropy alloy manufactured by selective laser melting

Xiaojun TAN, Haibing XIAO, Zihong WANG, Wei ZHANG, Zhijuan SUN, Xuyun PENG, Zhongmin LIU, Liang GUO, Qingmao ZHANG

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Front. Mech. Eng. ›› 2024, Vol. 19 ›› Issue (5) : 34. DOI: 10.1007/s11465-024-0804-4
RESEARCH ARTICLE

Laser polishing of a high-entropy alloy manufactured by selective laser melting

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Abstract

The selective laser melting (SLM) technique applied to high-entropy alloys (HEAs) has attracted considerable attention in recent years. However, its practical application has been restricted by poor surface quality. In this study, the capability of laser polishing on the rough surface of a Co-free HEA fabricated using SLM was examined. Results show that the initial SLM-manufactured (as-SLMed) surface of the Co-free HEA, with a roughness exceeding 3.0 μm, could be refined to less than 0.5 μm by laser polishing. Moreover, the microstructure, microhardness, and wear resistance of the laser-polished (LP-ed) zone were investigated. Results indicate that compared with the microhardness and wear resistance of the as-SLMed layer, those of the LP-ed layer decreased by 4% and 11%, respectively, because of the increase in grain size and reduction of the BCC phase. This study shows that laser polishing has an excellent application prospect in surface improvement of HEAs manufactured by SLM.

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Keywords

laser polishing / selective laser melting / high-entropy alloy / surface roughness / mechanical performance

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Xiaojun TAN, Haibing XIAO, Zihong WANG, Wei ZHANG, Zhijuan SUN, Xuyun PENG, Zhongmin LIU, Liang GUO, Qingmao ZHANG. Laser polishing of a high-entropy alloy manufactured by selective laser melting. Front. Mech. Eng., 2024, 19(5): 34 https://doi.org/10.1007/s11465-024-0804-4

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Acknowledgements

This work was financially supported by the Shenzhen Science and Technology Program, China (Grant No. GJHZ20220913143012022); the School-level Scientific Research Project of Shenzhen Institute of Technology, China (Grant No. 2211017); the Natural Science Foundation of Guangdong Province, China (Grant No. 2023A1515011641); the Key field Research Projects of Foshan City, China (Grant No. 2120001009232); the Guangdong Huazhong University of Science and Technology Industrial Technology Research Institute, China, and Guangdong Provincial Key Laboratory of Manufacturing Equipment Digitization, China (Grant No. 2020B1212060014); the Postdoctoral Science Foundation of China (Grant No. 2022M710503); and the Natural Science Foundation Commission of Chongqing, China (Grant No. CSTB2022NSCQ-BHX0029).

Electronic Supplementary Material

The supplementary material can be found in the online version of this article at https://doi.org/10.1007s/s11465-024-0804-4 and is accessible to authorized users.

Conflict of Interest

The authors declare that they have no conflict of interest.

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