Effects of taping on grinding quality of silicon wafers in backgrinding

Abstract

Taping is often used to protect patterned wafers and reduce fragmentation during backgrinding of silicon wafers. Grinding experiments using coarse and fine resin-bond diamond grinding wheels were performed on silicon wafers with tapes of different thicknesses to investigate the effects of taping on peak-to-valley (PV), surface roughness, and subsurface damage of silicon wafers after grinding. Results showed that taping in backgrinding could provide effective protection for ground wafers from breakage. However, the PV value, surface roughness, and subsurface damage of silicon wafers with taping deteriorated compared with those without taping although the deterioration extents were very limited. The PV value of silicon wafers with taping decreased with increasing mesh size of the grinding wheel and the final thickness. The surface roughness and subsurface damage of silicon wafers with taping decreased with increasing mesh size of grinding wheel but was not affected by removal thickness. We hope the experimental finding could help fully understand the role of taping in backgrinding.

Graphical abstract

Keywords

taping / silicon wafer / backgrinding / subsurface damage / surface roughness

References

[1] Teicher U, Dietz W, Nestler A, . Development of a process data-based strategy for conditioning position-controlled ID cut-off grinding wheels in silicon wafer manufacturing. Procedia Manufacturing, 2017, 11: 1984–1991

[2] Mosavat M, Rahimi A, Eshraghi M J, . Nano-finishing of the monocrystalline silicon wafer using magnetic abrasive finishing process. Applied Optics, 2019, 58(13): 3447–3453

[3] Jiang B, Chen Y, Fang A, . Surface stress evolution in through silicon via wafer during a backside thinning process. IEEE Transactions on Semiconductor Manufacturing, 2019, 32(4): 589–595

[4] Tu H. Behavior of impurities, defects and surface morphology for silicon and silicon based semiconducting materials. Engineering Science, 2000, 2(1): 7–17 (in Chinese)

[5] Gao S, Dong Z, Kang R, . Warping of silicon wafers subjected to back-grinding process. Precision Engineering, 2015, 40: 87–93

[6] Li K, Guo Q, Liu M, . A study on pore-forming agent in the resin bond diamond wheel used for silicon wafer back-grinding. Procedia Engineering, 2012, 36: 322–328

[7] Rusnaldy, Ko T J, Kim H S. An experimental study on microcutting of silicon using a micromilling machine. International Journal of Advanced Manufacturing Technology, 2008, 39(1–2): 85–91

[8] Zhang L, Chen P, An T, . Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process. Current Applied Physics, 2019, 19(5): 570–581

[9] Li J, Fang Q, Zhang L, . Subsurface damage mechanism of high speed grinding process in single crystal silicon revealed by atomistic simulations. Applied Surface Science, 2015, 324: 464–474

[10] Sun J, Qin F, Chen P, . A predictive model of grinding force in silicon wafer self-rotating grinding. International Journal of Machine Tools and Manufacture, 2016, 109: 74–86

[11] Lin B, Zhou P, Wang Z, . Analytical elastic–plastic cutting model for predicting grain depth-of-cut in ultrafine grinding of silicon wafer. Journal of Manufacturing Science and Engineering, 2018, 140(12): 121001–121007

[12] Gao S, Kang R, Dong Z, . Edge chipping of silicon wafers in diamond grinding. International Journal of Machine Tools and Manufacture, 2013, 64: 31–37

[13] Chen J, Wolf I D. Study of damage and stress induced by backgrinding in Si wafers. Semiconductor Science and Technology, 2003, 18(4): 261–268

[14] Ozturk S, Aydin L, Kucukdogan N, . Optimization of lapping processes of silicon wafer for photovoltaic applications. Solar Energy, 2018, 164: 1–11

[15] Zhang Y, Su J, Gao W, . Study on subsurface damage model of the ground monocrystallinge silicon wafers. Key Engineering Materials, 2009, 416: 66–70

[16] Mu D, Liu J, Cao Y, . The study on silicon grinding technology. Electronics and Packaging, 2010, 10: 9–13 (in Chinese)

[17] Pei Z, Kassir S, Bhagavat M, . An experimental investigation into soft-pad grinding of wire-sawn silicon wafers. International Journal of Machine Tools and Manufacture, 2004, 44(2–3): 299–306

[18] Liu H, Dong Z, Huang H, . A new method for measuring the flatness of large and thin silicon substrates using a liquid immersion technique. Measurement Science & Technology, 2015, 26(11): 115008–115017

[19] Zhu X, Chen X, Liu H, . An empirical equation for prediction of silicon wafer deformation. Materials Research Express, 2017, 4(6): 065904–065915

[20] Liu H, Dong Z, Kang K, . Analysis of factors affecting gravity-induced deflection for large and thin wafers in flatness measurement using three-point-support. Metrology and Measurement Systems, 2015, 22(4): 531–546

[21] Liu H, Zhu X, Kang R, . Three-point-support method based on position determination of supports and wafers to eliminate gravity-induced deflection of wafers. Precision Engineering, 2016, 46: 339–348

[22] Liu H, Kang R, Gao S, . Development of a measuring equipment for silicon wafer warp. Advanced Materials Research, 2013, 797: 561–565

[23] Agarwal S, Rao P V. Modeling and prediction of surface roughness in ceramic grinding. International Journal of Advanced Manufacturing Technology, 2010, 50(12): 1065–1076

[24] Sun J, Chen P, Qin F, . Modelling and experimental study of roughness in silicon wafer self-rotating grinding. Precision Engineering, 2018, 51: 625–637

[25] Chen X, Rowe W B. Analysis and simulation of the grinding process. Part II: Mechanics of grinding. International Journal of Machine Tools and Manufacture, 1996, 36(8): 883–896

[26] Malyarenko A, Ostoja-Starzewski M. A random field formulation of Hooke’s Law in all elasticity classes. Journal of Elasticity, 2017, 127(2): 269–302

[27] Gao S, Kang R K, Guo D M, . Study on the subsurface damage distribution of the silicon wafer ground by diamond wheel. Advanced Materials Research, 2010, 126‒128: 113–118

[28] Tönshoff H K, Schmieden W, Inasaki I, . Abrasive machining of silicon. CIRP Annals-Manufacturing Technology, 1990, 39(2): 621–635

[29] Brinksmeier E, Mutlugünes Y, Klocke F, . Ultra-precision grinding. CIRP Annals-Manufacturing Technology, 2010, 59(2): 652–671

[30] Malkin S, Guo C. Grinding Technology: Theory and Applications of Machining With Abrasives. 2nd ed. New York: Industrial Press, 2008

Acknowledgements

The authors acknowledge the financial support from the National Natural Science Foundation of China (Grant Nos. 51991372 and 51805135).

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2021 Higher Education Press