Laser sintering of Cu nanoparticles on PET polymer substrate for printed electronics at different wavelengths and process conditions

Abstract

This study explores the feasibility of different laser systems to sinter screen-printed lines from nonconductive copper nanoparticles (Cu NPs) on polyethylene terephthalate polymer film. These materials are commonly used in manufacturing functional printed electronics for large-area applications. Here, optical and thermal characterization of the materials is conducted to identify suitable laser sources and process conditions. Direct diode (808 nm), Nd:YAG (1064 nm and second harmonic of 532 nm), and ytterbium fiber (1070 nm) lasers are explored. Optimal parameters for sintering the Cu NPs are identified for each laser system, which targets low resistivity and high processing speed. Finally, the quality of the sintered tracks is quantified, and the laser sintering mechanisms observed under different wavelengths are analyzed. Practical considerations are discussed to improve the laser sintering process of Cu NPs.

Keywords

laser sintering / copper nanoparticles / printed electronics

References

[1] Ko S H, Pan H, Grigoropoulos C P, All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles. Nanotechnology, 2007, 18(34): 345202

[2] Buffat P, Borel J P. Size effect on the melting temperature of gold particles. Physical Review A, 1976, 13(6): 2287–2298

[3] Bieri N R, Chung J, Haferl S E, Microstructuring by printing and laser curing of nanoparticle solutions. Applied Physics Letters, 2003, 82(20): 3529–3531

[4] Kim T Y, Hwang J Y, Moon S J.Laser curing of the silver/copper nanoparticle ink via optical property measurement and calculation.Japanese Journal of Applied Physics, 2010, 49(5S1): 05EA09(1-6)

[5] Bieri N R, Chung J, Poulikakos D, An experimental investigation of microresistor laser printing with gold nanoparticle-laden inks. Applied Physics A, 2005, 80(7): 1485–1495

[6] Kim M K, Kang H, Kang K, . Laser sintering of inkjet-printed silver nanoparticles on glass and PET substrates. In: Proceedings of the 10th IEEE International Conference on Nanotechnology. Seoul: IEEE, 2010

[7] Chung J, Bieri N R, Ko S, In-tandem deposition and sintering of printed gold nanoparticle inks induced by continuous Gaussian laser irradiation. Applied Physics A, 2004, 79(4–6): 1259–1261

[8] Ko S H, Pan H, Grigoropoulos C P, Air stable high resolution organic transistors by selective laser sintering of ink-jet printed metal nanoparticles. Applied Physics Letters, 2007, 90(14): 141103–141105

[9] Bieri N R, Chung J, Poulikakos D, Manufacturing of nanoscale thickness gold lines by laser curing of a discretely deposited nanoparticle suspension. Superlattices and Microstructures, 2004, 35(3–6): 437–444

[10] Choi T Y, Poulikakos D, Grigoropoulos C P. Fountain-pen-based laser microstructuring with gold nanoparticle inks. Applied Physics Letters, 2004, 85(1): 13–15

[11] Chung J, Ko S, Bieri N R, Conductor microstructures by laser curing of printed gold nanoparticle ink. Applied Physics Letters, 2004, 84(5): 801–803

[12] Ko S H, Chung J, Pan H, Fabrication of multilayer passive and active electric components on polymer using inkjet printing and low temperature laser processing. Sensors and Actuators A: Physical, 2007, 134(1): 161–168

[13] Ko S H, Pan K, Hwang D J, . High resolution selective multilayer laser processing by nanosecond laser ablation of metal nanoparticle films. Journal of Applied Physics, 2007, 102: 093102

[14] Alemohammad H, Aminfar O, Toyserkani E. Morphology and microstructure analysis of nano-silver thin films deposited by laser-assisted maskless microdeposition. Journal of Micromechanics and Microengineering, 2008, 18(11): 115015

[15] Kumpulainen T, Pekkanen J. Utilization of 515 nm pulsed fiber laser for low temperature nanoparticle sintering. In: Proceedings of the 27th International Congress on Applications of Lasers & Electro-Optics. Temecula: Laser Institute of America, 2008

[16] Son Y, Lim T W, Yeo J, . Fabrication of nano-scale conductors by selective femtosecond laser sintering of metal nanoparticles. In: Proceedings of the 10th IEEE International Conference on Nanotechnology. Seoul: IEEE, 2010

[17] Kumpulainen T, Pekkanen J, Valkama J, Low temperature nanoparticle sintering with continuous wave and pulse lasers. Optics & Laser Technology, 2011, 43(3): 570–576

[18] Lesyuk R, Jillek W, Bobitski Y, Low-energy pulsed laser treatment of silver nanoparticles for interconnects fabrication by ink-jet method. Microelectronic Engineering, 2011, 88(3): 318–321

[19] Niizeki T, Maekawa K, Mita M, . Laser sintering of Ag nanopaste film and its application to bond-pad formation. In: Proceedings of the 58th Electronic Components and Technology Conference. Lake Buena Vista: IEEE, 2008, 1745–1750

[20] Kim M K, Hwang J Y, Kang H, . Laser sintering of the printed silver ink. In: Proceedings of the 2009 IEEE International Symposium on Assembly and Manufacturing. Suwon: IEEE, 2009, 155–158

[21] Laakso P, Ruotsalainen S, Halonen E, . Sintering of printed nanoparticle structures using laser treatment. In: Proceedings of the 28th International Congress on Applications of Lasers & Electro-Optics. Orlando, 2009

[22] Aminuzzaman M, Watanabe A, Miyashita T. Direct writing of conductive silver micropatterns on flexible polyimide film by laser-induced pyrolysis of silver nanoparticle-dispersed film. Journal of Nanoparticle Research, 2010, 12(3): 931–938

[23] Tsutsui Y, Yamasaki K, Maekawa K, . Size effect of Ag nanoparticles on laser sintering and wire bondability. In: Proceedings of the 60th Electronic Components and Technology Conference (ECTC 2010). Las Vegas: IEEE, 2010, 1870–1876

[24] Yoon Y H, Yi S M, Yim J R, Microstructure and electrical properties of high power laser thermal annealing on inkjet-printed Ag films. Microelectronic Engineering, 2010, 87(11): 2230–2233

[25] Kang B, Kno J, Yang M. High-resolution and high-conductive electrode fabrication on a low thermal resistance flexible substrate. Journal of Micromechanics and Microengineering, 2011, 21(7): 075017

[26] Kang B, Ko S, Kim J, Microelectrode fabrication by laser direct curing of tiny nanoparticle self-generated from organometallic ink. Optics Express, 2011, 19(3): 2573–2579

[27] Kim M G, Kanatzidis M G, Facchetti A, Low-temperature fabrication of high-performance metal oxide thin-film electronics via combustion processing. Nature Materials, 2011, 10(5): 382–388

[28] Lee D G, Kim D K, Moon Y J, Effect of temperature on electrical conductance of inkjet-printed silver nanoparticle ink during continuous wave laser sintering. Thin Solid Films, 2013, 546: 443–447

[29] Niittynen J, Abbel R, Mäntysalo M, Alternative sintering methods compared to conventional thermal sintering for inkjet printed silver nanoparticle ink. Thin Solid Films, 2014, 556: 452–459

[30] Qin G, Watanabe A. Conductive network structure formed by laser sintering of silver nanoparticles. Journal of Nanoparticle Research, 2014, 16(11): 2684

[31] Yung K C, Plura T S. Selective laser processing of ink-jet printed nano-scaled tin-clad copper particles. Applied Physics A, 2010, 101(2): 393–397

[32] Joo M, Lee B, Jeong S, Comparative studies on thermal and laser sintering for highly conductive Cu films printable on plastic substrate. Thin Solid Films, 2012, 520(7): 2878–2883

[33] Lee J, Lee B, Jeong S, Microstructure and electrical property of laser-sintered Cu complex ink. Applied Surface Science, 2014, 307: 42–45

[34] Lee J, Lee B, Jeong S, Enhanced surface coverage and conductivity of Cu complex ink-coated films by laser sintering. Thin Solid Films, 2014, 564: 264–268

[35] Yu J H, Kang K T, Hwang J Y, Rapid sintering of copper nano ink using a laser in air. International Journal of Precision Engineering and Manufacturing, 2014, 15(6): 1051–1054

[36] Intrinsiq Materials. Screen print copper paste for PV metalisation. Available at Intrinsiq Materials website on September 15, 2019

[37] Soltani A, Khorramdel Vahed B, Mardoukhi A, Laser sintering of copper nanoparticles on top of silicon substrates. Nanotechnology, 2016, 27(3): 035203

[38] Kwon J, Cho H, Eom H, Low-temperature oxidation-free selective laser sintering of Cu nanoparticle paste on a polymer substrate for the flexible touch panel applications. ACS Applied Materials & Interfaces, 2016, 8(18): 11575–11582

[39] Cheng C W, Chen J K. Femtosecond laser sintering of copper nanoparticles. Applied Physics A, 2016, 122(4): 289

[40] Roy N K, Dibua O G, Jou W, A comprehensive study of the sintering of copper nanoparticles using femtosecond, nanosecond, and continuous wave lasers. Journal of Micro and Nano-Manufacturing, 2017, 6(1): 010903

[41] Roy N K, Dibua O G, Foong C S, Preliminary results on the fabrication of interconnect structures using microscale selective laser sintering. In: Proceedings of ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Francisco: ASME, 2017, IPACK2017-74173, V001T01A001

[42] Roy N K, Jou W, Feng H, Laser sintering of copper nanoparticles: A simplified model for fluence estimation and validation. In: Proceedings of the 12th International Manufacturing Science and Engineering Conference. Los Angeles: ASME, 2017, MSEC2017-2975, V002T01A032

[43] Perry R H. Perry’s Chemical Engineers’ Handbook. 7th ed. New York: McGraw-Hill, 1997

[44] Shyjumon I, Gopinadhan M, Ivanova O, Structural deformation, melting point and lattice parameter studies of size selected silver clusters. European Physical Journal D, 2006, 37(3): 409–415

[45] Son Y, Yeo J, Moon H, Nanoscale electronics: Digital fabrication by direct femtosecond laser processing of metal nanoparticles. Advanced Materials, 2011, 23(28): 3176–3181

[46] Lawrence Yao Y, Chen H, Zhang W. Time scale effects in laser material removal: A review. International Journal of Advanced Manufacturing Technology, 2005, 26(5–6): 598–608

[47] Hu M, Hartland G V. Heat dissipation for Au particles in aqueous solution: Relaxation time versus size. Journal of Physical Chemistry B, 2002, 106(28): 7029–7033

[48] Kang J S, Kim H S, Ryu J, Inkjet printed electronics using copper nanoparticle ink. Journal of Materials Science Materials in Electronics, 2010, 21(11): 1213–1220

[49] MacDonald W A. Engineered films for display technologies. Journal of Materials Chemistry, 2004, 14(1): 4–10

[50] Bäuerle D. Laser Processing and Chemistry. Berlin: Springer, 2011, 739–781

[51] Min H, Lee B, Jeong S, Laser-direct process of Cu nano-ink to coat highly conductive and adhesive metallization patterns on plastic substrate. Optics and Lasers in Engineering, 2016, 80: 12–16

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