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Frontiers of Mechanical Engineering

Front. Mech. Eng.    2017, Vol. 12 Issue (4) : 459-476     https://doi.org/10.1007/s11465-017-0462-x
REVIEW ARTICLE |
Fabrication of Si-based three-dimensional microbatteries: A review
Chuang YUE1,2, Jing LI1(), Liwei LIN2
1. Collaborative Innovation Center for Optoelectronic Semiconductors and Efficient Devices, Pen-Tung Sah Institute of Micro-Nano Science and Technology, Xiamen University, Xiamen 361005, China
2. Department of Mechanical Engineering, University of California, Berkeley, CA 94720, USA
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Abstract

High-performance, Si-based three-dimensional (3D) microbattery systems for powering micro/nano-electromechanical systems and lab-on-chip smart electronic devices have attracted increasing research attention. These systems are characterized by compatible fabrication and integratibility resulting from the silicon-based technologies used in their production. The use of support substrates, electrodes or current collectors, electrolytes, and even batteries used in 3D layouts has become increasingly important in fabricating microbatteries with high energy, high power density, and wide-ranging applications. In this review, Si-based 3D microbatteries and related fabrication technologies, especially the production of micro-lithium ion batteries, are reviewed and discussed in detail in order to provide guidance for the design and fabrication.

Keywords three-dimensional (3D)      wafer-scale      Si-based anode      micro-LIBs      thin-film deposition     
Corresponding Authors: Jing LI   
Just Accepted Date: 07 June 2017   Online First Date: 19 September 2017    Issue Date: 31 October 2017
 Cite this article:   
Chuang YUE,Jing LI,Liwei LIN. Fabrication of Si-based three-dimensional microbatteries: A review[J]. Front. Mech. Eng., 2017, 12(4): 459-476.
 URL:  
http://journal.hep.com.cn/fme/EN/10.1007/s11465-017-0462-x
http://journal.hep.com.cn/fme/EN/Y2017/V12/I4/459
Fig.1  Market forecasting of the different Si-based MEMS smart devices in the future [4]
Fig.2  Ragone plot of different electrochemical energy storage systems. Reprinted with permission from Ref. [14]. Copyright 2001, Nature Publishing Group
Fig.3  Illustration of the working principle of a Li-ion battery [15]
Fig.4  Reactions that occur in the electrodes of a Li-ion battery during the charge/discharge process [15]
Fig.5  Applications of different Li-ion battery energy storage systems [1728]
Fig.6  (a) Diagram of a conventional 2D all-solid-state thin-film Li-ion battery structure and (b) its SEM section view. Reprinted with permission from Ref. [29], Copyright 2000, Elsevier. (c) Advantages of the 3D battery structure [30]
Fig.7  Different structures of 3D micro-LIBs. (a) 3D Al current collector. Reprinted with permission from Ref. [33], Copyright 2009, American Chemical Society. (b) 3D Si electrode. Reproduced with permission from Ref. [34], Copyright 2013, Wiley-VCH. (c) 3D solid state electrolyte based on Ref. [35]. (d) 3D Si-based architectures. Reproduced with permission from Ref. [36], Copyright 2007, Wiley-VCH
Fig.8  (a) Theoretical capacity and relative potential vs. Li/Li+ of common electrodes in LIBs. Reprinted with permission from Ref. [44], Copyright 2009, Royal Society of Chemistry. (b) Scanning electron microscopy (SEM) image of the complex Si-based microchip structure; (c) wafer-scale LIB units can be potentially integrated with the micro/nano-intelligent electronic devices [4547]
Fig.9  (a) Schematic illustration of different Si anode morphology changes after lithiation process. Reprinted with permission from Ref. [48], Copyright 2007, Nature Publishing Group. (b) The two main methods used to solve the issue of large volume expansion in Si electrodes. Reprinted with permission from Refs. [48,49], Copyright 2007/2012, Nature Publishing Group; reprinted with permission from Refs. [50,52?54], Copyright 2011/2012/2012/2011, American Chemical Society; reproduced with permission from Ref. [55], Copyright 2014, Wiley-VCH
Fig.10  (a) Scheme of 3D integrated all-solid-state micro-LIB. Reproduced with permission from Ref. [36], Copyright 2007, Wiley-VCH. (b)–(d) SEM images of different locations in 3D Si/TiN/poly-Si electrodes (AR 10 and 20); (e) the cycle performance of the 3D TiN/poly-Si stacks (AR 10 and 20) at a current density of 25mA·cm−2 within a voltage window from 0–3 V vs. Li/Li+; (f)–(g) SEM images of the 3D Si/TiN/poly-Si electrode (AR 10) after 10 charge/discharge cycles. Reprinted with permission from Ref. [60], Copyright 2010, Royal Society of Chemistry
Fig.11  SEM images of the (a) Si/photoresist microtubes and (b) Si/Pt/TiO2 microtubes after the etching mask removal, ALD of Pt and TiO2; (c)–(d) scanning transmission electron microscopy (STEM) image of a single Si/Pt/TiO2 microtube and the energy-dispersive X-ray spectroscopy (EDX) elemental mapping for Ti, Si, and Pt elements; (e) cyclic voltammetry (CV) measurement results of the 2D planar, micropillars, and microtubules electrodes decorated with the Pt/TiO2 layers; (f) gavalnostatic charge/discharge testing for the 2D (TiO2 layer, 60 nm) and 3D Si/Pt/TiO2 microtube electrodes (S1 samples: TiO2 layer, 60 nm). Reproduced with permission from Ref. [64], Copyright 2014, Wiley-VCH
Fig.12  (a)–(b) SEM images of the fabricated Si double microtubes before and after the removal of photoresist mask using the deep reactive ion etching technique; (c)–(f) different magnification TEM images of Al2O3/Pt/TiO2/Li3PO4 stacking layers coated on the 3D double microtubes; (g)–(l) EDX-STEM elemental mapping of the Si-3D/Al2O3/Pt/TiO2/Li3PO4/SiO2-protective stacked layers; (m) high-resolution transmission electron microscopy (HRTEM) image of the Pt/TiO2/Li3PO4 layers; (n)–(o) the differential surface capacity versus potential plots and the rate performance of the Si-3D (simple microtube: SMT)/Al2O3/Pt/TiO2/Li3PO4 electrodes. Reproduced with permission from Ref. [65], Copyright 2016, Wiley-VCH
Fig.13  (a) SEM image of the photoresist mold patterned on the Si wafer; (b) SEM image of the 3D Au current collector employing electroplating followed by the mold removal; (c) SEM image of the Tobacco mosaic virus (TMV) nanostructures self-assembled onto the 3D gold micropillars surface and then coated with Ni thin-film in an electroless plating solution, followed by ALD of V2O5 anode; (d) TEM image of an individual virus-templated nanorod; (e) SEM image of a single Si/Au-3D/TMV/Ni/V2O5 micropillar in a close-up top view; (f) CV measurement and (g) cycle performance of the virus-structured electrodes with and without 3D Au micropillars; (1)–(4) Scheme of the Si/Au-3D/TMV/Ni/V2O5 micropillar electrodes fabrication process. Reproduced with permission from Ref. [66], Copyright 2012, American Chemical Society
Fig.14  (a–b) Schematic description of a 3D micro-LIB on a perforated Si or glass substrates. Reproduced with permission from Refs. [69,70], Copyright 2005/2006, Elsevier. (c) Comparison of the areal capacity between the 3D micro-LIB and 2D thin-film micro-LIB. Data based on Ref. [71]
Fig.15  (a) The fabrication process of the 3D micro-LIB; (b–c) SEM images of C/PPYDBS interdigitated electrode arrays and (d) its charge/discharge characteristic. Reproduced with permission from Ref. [72], Copyright 2007, Elsevier
Fig.16  (a) Overview of the 3D all-solid-state integrated micro-LIB; (b)–(d) SEM images of the Si NPL arrays after the LiPON/LiFePO4 deposition. Reproduced with permission from Ref. [76], Copyright 2011, Elsevier
Fig.17  Areal capacity vs. different 3D Si-based micro-LIB electrodes (black arrow: SEM images of the electrodes after Li-ion inserting/de-inserting process; bottom: SEM image of a 3D all-solid-state micro/nano-LIB arrays in the section view) [7982]. Reproduced with permission from Ref. [83], Copyright 2016, American Chemical Society; Reproduced with permission from Ref. [84], Copyright 2015, Wiley-VCH
Fig.18  Optimization of a Si-based all-solid-state micro-LIB from 2D to semi-3D
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