Additive direct-write microfabrication for MEMS: A review

Abstract

Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from computer-generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techniques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept-to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the maker movement. The technological premises of all direct-write additive manufacturing are identical—converting computer generated three-dimensional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into three-dimensional solid objects in a layer-by-layer format. The key differences between the various additive manufacturing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to-prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive manufacturing technologies, it is possible to fabricate unsophisticated micrometer scale structures at adequate resolutions and precisions using materials that range from polymers, metals, ceramics, to composites. In both academia and industry, direct-write additive manufacturing offers extraordinary promises to revolutionize research and development in microfabrication and MEMS technologies. Importantly, direct-write additive manufacturing could appreciably augment current MEMS fabrication technologies, enable faster design-to-product cycle, empower new paradigms in MEMS designs, and critically, encourage wider participation in MEMS research at institutions or for individuals with limited or no access to cleanroom facilities. This article aims to provide a limited review of the current landscape of direct-write additive manufacturing techniques that are potentially applicable for MEMS microfabrication.

Graphical abstract

Keywords

direct-write / additive manufacturing / microfabrication / MEMS

References

[1] Frazier A B, Warrington R O, Friedrich C. The miniaturization technologies: Past, present, and future. IEEE Transactions on Industrial Electronics, 1995, 42(5): 423–430

[2] Yazdi N, Ayazi F, Najafi K. Micromachined inertial sensors. Proceedings of the IEEE, 1998, 86(8): 1640–1659

[3] Gessner T, Doetzel W, Billep D, Silicon mirror arrays fabricated by using bulk and surface micromachining. Proceedings of the SPIE, Miniaturized Systems with Micro-Optics and Micromechanics II, 1997, 3008: 296–305

[4] Tsung Pan A I. US Patent 4894664, 1990-01-16

[5] Lemkin M, Boser B E. A three-axis micromachined accelerometer with a CMOS position-sense interface and digital offset-trim electronics. IEEE Journal of Solid-State Circuits, 1999, 34(4): 456–468

[6] Takao H, Fukumoto H, Ishida M. A CMOS integrated three-axis accelerometer fabricated with commercial submicrometer CMOS technology and bulk-micromachining. IEEE Transactions on Electron Devices, 2001, 48(9): 1961–1968

[7] Voldman J, Gray M L, Schmidt M A. Microfabrication in biology and medicine. Annual Review of Biomedical Engineering, 1999, 1(1): 401–425

[8] Unger M A, Chou H P, Thorsen T, Monolithic microfabricated valves and pumps by multilayer soft lithography. Science, 2000, 288(5463): 113–116

[9] McGlennen R C. Miniaturization technologies for molecular diagnostics. Clinical Chemistry, 2001, 47(3): 393–402

[10] Eaton W P, Smith J H. Micromachined pressure sensors: Review and recent developments. Smart Materials and Structures, 1997, 6(5): 530–539

[11] Eddy D S, Sparks D R. Application of MEMS technology in automotive sensors and actuators. Proceedings of the IEEE, 1998, 86(8): 1747–1755

[12] Lucyszyn S. Review of radio frequency microelectromechanical systems technology. IEE Proceedings. Science Measurement and Technology, 2004, 151(2): 93–103

[13] Briand D, van der Schoot B, de Rooij N F, . A low-power micromachined MOSFET gas sensor. Journal of Microelectromechanical Systems, 2000, 9(3): 303–308

[14] Wu M C. Micromachining for optical and optoelectronic systems. Proceedings of the IEEE, 1997, 85(11): 1833–1856

[15] McAllister D V, Allen M G, Prausnitz M R. Microfabricated microneedles for gene and drug delivery. Annual Review of Biomedical Engineering, 2000, 2(1): 289–313

[16] Bustillo J M, Howe R T, Muller R S. Surface micromachining for microelectromechanical systems. Proceedings of the IEEE, 1998, 86(8): 1552–1574

[17] Howe R T. Surface micromachining for microsensors and microactuators. Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures: Processing, Measurement, and Phenomena: An Official Journal of the American Vacuum Society, 1988, 6(6): 1809–1813

[18] Kovacs G T, Petersen K, Albin M. Peer reviewed: Silicon micromachining: Sensors to systems. Analytical Chemistry, 1996, 68(13): 407A–412A

[19] Hoffmann M, Voges E. Bulk silicon micromachining for MEMS in optical communication systems. Journal of Micromechanics and Microengineering, 2002, 12(4): 349–360

[20] Kovacs G T, Maluf N I, Petersen K E. Bulk micromachining of silicon. Proceedings of the IEEE, 1998, 86(8): 1536–1551

[21] Burrer Chr, Esteve J. A novel resonant silicon accelerometer in bulk-micromachining technology. Sensors and Actuators. A, Physical, 1995, 46(1–3): 185–189

[22] Hormes J, Göttert J, Lian K, Materials for LiGA and LiGA-based microsystems. Nuclear Instruments & Methods in Physics Research. Section B, Beam Interactions with Materials and Atoms, 2003, 199: 332–341

[23] Katoh T, Nishi N, Fukagawa M, Direct writing for three-dimensional microfabrication using synchrotron radiation etching. Sensors and Actuators. A, Physical, 2001, 89(1–2): 10–15

[24] Kupka R K, Bouamrane F, Cremers C, Microfabrication: LIGA-X and applications. Applied Surface Science, 2000, 164(1–4): 97–110

[25] Cheng Y, Shew B Y, Chyu M K, Ultra-deep LIGA process and its applications. Nuclear Instruments & Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment, 2001, 467–468: 1192–1197

[26] Malek C K, Saile V. Applications of LIGA technology to precision manufacturing of high-aspect-ratio micro-components and -systems: A review. Microelectronics Journal, 2004, 35(2): 131–143

[27] del Campo A, Greiner C. SU-8: A photoresist for high-aspect-ratio and 3D submicron lithography. Journal of Micromechanics and Microengineering, 2007, 17(6): R81–R95

[28] Madou M J. Manufacturing Techniques for Microfabrication and Nanotechnology. Boca Raton: CRC Press, 2011

[29] Jansen H, Gardeniers H, de Boer M, A survey on the reactive ion etching of silicon in microtechnology. Journal of Micromechanics and Microengineering, 1996, 6(1): 14–28

[30] Sterner M, Roxhed N, Stemme G, Electrochemically assisted maskless selective removal of metal layers for three-dimensional micromachined SOI RF MEMS transmission lines and devices. Journal of Microelectromechanical Systems, 2011, 20(4): 899–908

[31] Zahedinejad M, Farimani S D, Khaje M, Deep and vertical silicon bulk micromachining using metal assisted chemical etching. Journal of Micromechanics and Microengineering, 2013, 23(5): 055015

[32] Kim S M, Khang D Y. Bulk micromachining of Si by metal-assisted chemical etching. Small, 2014, 10(18): 3761–3766

[33] Zhang M L, Peng K Q, Fan X, Preparation of large-area uniform silicon nanowires arrays through metal-assisted chemical etching. Journal of Physical Chemistry C, 2008, 112(12): 4444–4450

[34] Saif M T, MacDonald N C. Design considerations for large MEMS. Proceedings of the SPIE: Smart Structures and Materials: Smart Electronics, 1995, 2448: 93–104

[35] Chu P B, Lee S S, Park S. MEMS: The path to large optical crossconnects. IEEE Communications Magazine, 2002, 40(3): 80–87

[36] Samuelson S R, Xie H. A large piston displacement MEMS mirror with electrothermal ladder actuator arrays for ultra-low tilt applications. Journal of Microelectromechanical Systems, 2014, 23(1): 39–49

[37] Lv X, Wei W, Mao X, A novel MEMS electromagnetic actuator with large displacement. Sensors and Actuators. A, Physical, 2015, 221: 22–28

[38] Reddy J, Pratap R. Si-gold-glass hybrid wafer bond for 3D-MEMS and wafer level packaging. Journal of Micromechanics and Microengineering, 2016, 27(1): 015005

[39] Ko C T, Chen K N. Low temperature bonding technology for 3D integration. Microelectronics and Reliability, 2012, 52(2): 302–311

[40] Dragoi V, Pabo E, Burggraf J, CMOS: Compatible wafer bonding for MEMS and wafer-level 3D integration. Microsystem Technologies, 2012, 18(7–8): 1065–1075

[41] Halder S, Stiers K, Miller A, Metrology and inspection challenges for manufacturing 3D stacked IC’s. In: Proceedings of ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference. IEEE, 2013, 75–79

[42] Ishida H, Sood S, Rosenthal C, Temporary bonding/de-bonding and permanent wafer bonding solutions for 3D integration. In: Proceedings of 2nd IEEE CPMT Symposium Japan. IEEE, 2012, 1–4

[43] Alam A U, Howlader M M, Deen M J. Oxygen plasma and humidity dependent surface analysis of silicon, silicon dioxide and glass for direct wafer bonding. ECS Journal of Solid State Science and Technology, 2013, 2(12): 515–523

[44] PolyMUMPs. 2016. Retrieved from MEMSCAP website, 2016-9-15

[45] MEMS Foundry Services. 2016. Available from TDK website, 2016-9-15

[46] Berman B. 3-D printing: The new industrial revolution. Business Horizons, 2012, 55(2): 155–162

[47] Petrick I J, Simpson T W. 3D printing disrupts manufacturing: How economies of one create new rules of competition. Research Technology Management, 2013, 56(6): 12–16

[48] Gebler M, Schoot Uiterkamp A J M, Visser C. A global sustainability perspective on 3D printing technologies. Energy Policy, 2014, 74: 158–167

[49] Kumar S S, Pant B D. Design principles and considerations for the ‘ideal’ silicon piezoresistive pressure sensor: A focused review. Microsystem Technologies, 2014, 20(7): 1213–1247

[50] Narducci M, Yu-Chia L, Fang W, CMOS MEMS capacitive absolute pressure sensor. Journal of Micromechanics and Microengineering, 2013, 23(5): 055007

[51] Littrell R, Grosh K. Modeling and characterization of cantilever-based MEMS piezoelectric sensors and actuators. Journal of Microelectromechanical Systems, 2012, 21(2): 406–413

[52] Hu F, Yao J, Qiu C, A MEMS micromirror driven by electrostatic force. Journal of Electrostatics, 2010, 68(3): 237–242

[53] Wright N G, Horsfall A B. SiC sensors: A review. Journal of Physics. D, Applied Physics, 2007, 40(20): 6345–6354

[54] Sarro P M. Silicon carbide as a new MEMS technology. Sensors and Actuators. A, Physical, 2000, 82(1–3): 210–218

[55] Wu C H, Zorman C A, Mehregany M. Fabrication and testing of bulk micromachined silicon carbide piezoresistive pressure sensors for high temperature applications. IEEE Sensors Journal, 2006, 6(2): 316–324

[56] Mehregany M, Zorman C A, Rajan N, Silicon carbide MEMS for harsh environments. Proceedings of the IEEE, 1998, 86(8): 1594–1609

[57] Tejada F, Andreou A G, Wickenden D K, Surface micromachining in silicon on sapphire CMOS technology. In: Proceedings of the 2004 International Symposium on Circuits and Systems. ISCAS ‘04. Vancouver: IEEE, 2004, 920–923

[58] Wang J, Butler J E, Feygelson T, 1.51-GHz nanocrystalline diamond micromechanical disk resonator with material-mismatched isolating support. In: Proceedings of 17th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2004. Maastricht: IEEE, 2004, 641–644

[59] Naing T L, Beyazoglu T, Wu L, 2.97-GHz CVD diamond ring resonator with Q>40,000. In: Proceedings of 2012 IEEE International Frequency Control Symposium. Baltimore: IEEE, 2012, 1–6

[60] Franke A E, Heck J M, King T J, Polycrystalline silicon-germanium films for integrated microsystems. Journal of Microelectromechanical Systems, 2003, 12(2): 160–171

[61] Teh K S, Cheng Y T, Lin L. MEMS fabrication based on nickel-nanocomposite: Film deposition and characterization. Journal of Micromechanics and Microengineering, 2005, 15(12): 2205–2215

[62] Meng E, Tai Y C. A parylene MEMS flow sensing array. In: Proceedings of 12th International Conference on Transducers, Solid-State Sensors, Actuators and Microsystems. Boston: IEEE, 2003, 686–689

[63] Mescher M, Abe T, Brunett B, Piezoelectric lead-zirconate-titanate actuator films for microelectromechanical systems applications. In: Proceedings of IEEE Micro Electro Mechanical Systems. MEMS ’95. Amsterdam: IEEE, 1995, 261

[64] Bastani Y, Bassiri-Gharb N. Processing optimization of lead magnesium niobite-lead titanate thin films for piezoelectric MEMS application. Journal of the American Ceramic Society, 2012, 95(4): 1269–1275

[65] Polcawich R G, Pulskamp J S. Lead zirconate titanate (PZT) for M/NEMS. In: Bhugra H, Piazza G, eds. Piezoelectric MEMS Resonators. Microsystems and Nanosystems. Cham: Springer, 2017, 39–71

[66] Wang G, Polley T, Hunt A, A high performance tunable RF MEMS switch using barium strontium titanate (BST) dielectrics for reconfigurable antennas and phased arrays. IEEE Antennas and Wireless Propagation Letters, 2005, 4(1): 217–220

[67] Marvell Nanofabrication Laboratory Lab Manual. Chapter 1.10: Miscellaneous Etchants. 2016. Retrieved from Berkeley Marvell NanoLab at CITRIS website, 2016-8-30

[68] Nguyen N T, Huang X, Chuan T K. MEMS-micropumps: A review. Journal of Fluids Engineering, 2002, 124(2): 384–392

[69] Malek C K, Saile V. Applications of LIGA technology to precision manufacturing of high-aspect-ratio micro-components and -systems: A review. Microelectronics Journal, 2004, 35(2): 131–143

[70] Bertsch A, Jiguet S, Bernhard P, Microstereolithography: A review. In: Materials Research Society Symposium Proceedings, Cambridge: Cambridge University Press, 2002, 758: LL1–1

[71] Sun H B, Kawata S. Two-photon photopolymerization and 3D lithographic microfabrication. In: NMR•3D Analysis•Photopolymerization. Apvances in Polymer Science. Volume 170. Berlin: Springer, 2004, 169–273

[72] Pao Y H, Rentzepis P M. Laser-induced production of free radicals in organic compounds. Applied Physics Letters, 1965, 6(5): 93–95

[73] Ikuta K, Hirowatari K. Real three dimensional micro fabrication using stereo lithography and metal molding. In: Proceedings of An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. Micro Electro Mechanical Systems, MEMS ’93. Fort Lauderdale: IEEE, 1993, 42–47

[74] Sun C, Fang N, Wu D M, Projection micro-stereolithography using digital micro-mirror dynamic mask. Sensors and Actuators. A, Physical, 2005, 121(1): 113–120

[75] Stampfl J, Fouad H, Seidler S, Fabrication and moulding of cellular materials by rapid prototyping. International Journal of Materials & Product Technology, 2004, 21(4): 285–296

[76] Zheng X, Lee H, Weisgraber T H, Ultralight, ultrastiff mechanical metamaterials. Science, 2014, 344(6190): 1373–1377

[77] Farahani R D, Chizari K, Therriault D. Three-dimensional printing of freeform helical microstructures: A review. Nanoscale, 2014, 6(18): 10470–10485

[78] Kobayashi K, Ikuta K. Three-dimensional magnetic microstructures fabricated by microstereolithography. Applied Physics Letters, 2008, 92(26): 262505

[79] Kotz F, Arnold K, Bauer W, Three-dimensional printing of transparent fused silica glass. Nature, 2017, 544(7650): 337–339

[80] Alblalaihid K, Overton J, Lawes S, A 3D-printed polymer micro-gripper with self-defined electrical tracks and thermal actuator. Journal of Micromechanics and Microengineering, 2017, 27(4): 045019

[81] Xu G, Zhao W, Tang Y, Novel stereolithography system for small size objects. Rapid Prototyping Journal, 2006, 12(1): 12–17

[82] Kawata S, Sun H B, Tanaka T, Finer features for functional microdevices. Nature, 2001, 412(6848): 697–698

[83] Mueller P, Thiel M, Wegener M. 3D direct laser writing using a 405 nm diode laser. Optics Letters, 2014, 39(24): 6847–6850

[84] Sochol R D, Heo Y J, Iwanaga S, Cells on arrays of microsprings: An approach to achieve tri-axial control of substrate stiffness. In: Proceedings of IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS). Taipei: IEEE, 2013, 90–93

[85] Maruo S, Ikuta K, Korogi H. Force-controllable, optically driven micromachines fabricated by single-step two-photon microstereolithography. Journal of Microelectromechanical Systems, 2003, 12(5): 533–539

[86] Choi J W, Wicker R B, Cho S H, Cure depth control for complex 3D microstructure fabrication in dynamic mask projection microstereolithography. Rapid Prototyping Journal, 2009, 15(1): 59–70

[87] Gissibl T, Thiele S, Herkommer A, Two-photon direct laser writing of ultracompact multi-lens objectives. Nature Photonics, 2016, 10(8): 554–560

[88] Nanoscribe GmBH. 2017. Retrieved from Nanoscribe website, 2017-7-15

[89] Tumbleston J R, Shirvanyants D, Ermoshkin N, Continuous liquid interface production of 3D objects. Science, 2015, 347(6228): 1349–1352

[90] Thiel M, Hermatschweiler M. Three-dimensional laser lithography. Optik & Photonik, 2011, 6(4): 36–39

[91] Göring G, Dietrich P I, Blaicher M, Tailored probes for atomic force microscopy fabricated by two-photon polymerization. Applied Physics Letters, 2016, 109(6): 063101

[92] Xiong W, Zhou Y S, He X N, Simultaneous additive and subtractive three-dimensional nanofabrication using integrated two-photon polymerization and multiphoton ablation. Light, Science & Applications, 2012, 1(4): e6

[93] Varadan V K, Jiang X, Varadan V V. Microstereolithography and Other Fabrication Techniques for 3D MEMS. New York: John Wiley & Sons, 2001

[94] Ikuta K, Ogata T, Tsubio M, Development of mass productive micro stereo lithography (Mass-IH Process). In: Proceedings of the Ninth Annual International Workshop on Micro Electro Mechanical Systems, MEMS ’96. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. San Diego: IEEE, 1996, 301–306

[95] Neumann J, Wieking K S, Kip D. Direct laser writing of surface reliefs in dry, self-developing photopolymer films. Applied Optics, 1999, 38(25): 5418–5421

[96] Bártolo P J. Stereolithography: Materials, Processes and Applications. New Yrok: Springer, 2011

[97] Lifton V A, Lifton G, Simon S. Options for additive rapid prototyping methods (3D printing) in MEMS technology. Rapid Prototyping Journal, 2014, 20(5): 403–412

[98] Vaezi M, Seitz H, Yang S. A review on 3D micro-additive manufacturing technologies. International Journal of Advanced Manufacturing Technology, 2013, 67(5–8): 1721–1754

[99] Gibson I, Rosen D W, Stucker B. Additive Manufacturing Technologies. New York: Springer, 2010

[100] Lee J W, Lee I H, Cho D W. Development of micro-stereolithography technology using metal powder. Microelectronic Engineering, 2006, 83(4–9): 1253–1256

[101] Lee K S, Kim R H, Yang D Y, Advances in 3D nano/microfabrication using two-photon initiated polymerization. Progress in Polymer Science, 2008, 33(6): 631–681

[102] EnvisionTec Perfactory 3D Printer. 2017. Retrieved from EnvisionTec website, 2017-7-15

[103] Kawata S, Sun H B, Tanaka T, Finer features for functional microdevices. Nature, 2001, 412(6848): 697–698

[104] Abe F, Osakada K, Shiomi M, The manufacturing of hard tools from metallic powders by selective laser melting. Journal of Materials Processing Technology, 2001, 111(1–3): 210–213

[105] Exner H, Streek A. High resolution laser micro sintering/melting using q-switched and high brilliant laser radiation. Proceedings of the SPIE, International Society for Optics and Photonics, 2015, 9353: 93530P

[106] Exner H, Horn M, Streek A, Laser micro sintering: A new method to generate metal and ceramic parts of high resolution with sub-micrometer powder. Virtual and Physical Prototyping, 2008, 3(1): 3–11

[107] Petsch T, Regenfuß P, Ebert R, Industrial laser micro sintering. In: Proceedings of the 23rd International Congress on Applications of Lasers and Electro-Optics 2004. Erlangen, 2004

[108] Exner H, Regenfuss P, Hartwig L, Selective laser micro sintering with a novel process. Proceedings of SPIE, Fourth International Symposium on Laser Precision Microfabrication, 2003, 5063: 145–151

[109] Regenfuss P, Streek A, Hartwig L, Principles of laser micro sintering. Rapid Prototyping Journal, 2007, 13(4): 204–212

[110] Hong S, Yeo J, Kim G, Nonvacuum, maskless fabrication of a flexible metal grid transparent conductor by low-temperature selective laser sintering of nanoparticle ink. ACS Nano, 2013, 7(6): 5024–5031

[111] Liu Y K, Lee M T. Laser direct synthesis and patterning of silver nano/microstructures on a polymer substrate. ACS Applied Materials & Interfaces, 2014, 6(16): 14576–14582

[112] Kwon J, Cho H, Eom H, Low-temperature oxidation-free selective laser sintering of Cu nanoparticle paste on a polymer substrate for the flexible touch panel applications. ACS Applied Materials & Interfaces, 2016, 8(18): 11575–11582

[113] Bohandy J, Kim B F, Adrian F J. Metal deposition from a supported metal film using an excimer laser. Journal of Applied Physics, 1986, 60(4): 1538–1539

[114] Birnbaum A J, Auyeung R C, Wahl K J, Laser printed micron-scale free standing laminate composites: Process and properties. Journal of Applied Physics, 2010, 108(8): 083526

[115] Wang J, Auyeung R C, Kim H, Three-dimensional printing of interconnects by laser direct-write of silver nanopastes. Advanced Materials, 2010, 22(40): 4462–4466

[116] Visser C W, Pohl R, Sun C, Toward 3D printing of pure metals by laser-induced forward transfer. Advanced Materials, 2015, 27(27): 4087–4092

[117] Piqué A, Chrisey D B. Direct-Write Technologies for Rapid Prototyping Applications: Sensors, Electronics, and Integrated Power Sources. New York: Academic Press, 2001

[118] Piqué A, Chrisey D B, Auyeung R C, A novel laser transfer process for direct writing of electronic and sensor materials. Applied Physics. A, Materials Science & Processing, 1999, 69(1): S279–S284

[119] Piqué A, Auyeung R C, Kim H, Laser 3D micro-manufacturing. Journal of Physics. D, Applied Physics, 2016, 49(22): 223001

[120] Chrisey D B, Pique A, Fitz-Gerald J, New approach to laser direct writing active and passive mesoscopic circuit elements. Applied Surface Science, 2000, 154–155: 593–600

[121] Birnbaum A J, Kim H, Charipar N A, Laser printing of multi-layered polymer/metal heterostructures for electronic and MEMS devices. Applied Physics. A, Materials Science & Processing, 2010, 99(4): 711–716

[122] Piqué A, Kim H, Auyeung R C, Laser forward transfer of functional materials for digital fabrication of microelectronics. Journal of Imaging Science and Technology, 2013, 57(4): 40404

[123] Kim H, Duocastella M, Charipar K M, Laser printing of conformal and multi-level 3D interconnects. Applied Physics. A, Materials Science & Processing, 2013, 113(1): 5–8

[124] Auyeung R C, Kim H, Birnbaum A J, Laser decal transfer of freestanding microcantilevers and microbridges. Applied Physics. A, Materials Science & Processing, 2009, 97(3): 513–519

[125] Piqué A, Auyeung R, Metkus K, Laser decal transfer of electronic materials with thin film characteristics. Proceedings of SPIE, 2008, 6879: 687911

[126] Delaporte P, Alloncle A P. Laser-induced forward transfer: A high resolution additive manufacturing technology. Optics & Laser Technology, 2016, 78: 33–41

[127] Zhang S, Tu R, Goto T. High-speed epitaxial growth of -SiC film on Si (111) single crystal by laser chemical vapor deposition. Journal of the American Ceramic Society, 2012, 95(9): 2782–2784

[128] Zhang S, Xu Q, Tu R, Growth mechanism and defects of<111>-oriented-SiC films deposited by laser chemical vapor deposition. Journal of the American Ceramic Society, 2015, 98(1): 236–241

[129] Ehrlich D J, Tsao J Y. Laser Microfabrication: Thin Film Processes and Lithography. Boston: Academic Press, 1989

[130] Shen B, Izquierdo R, Meunier M. Laser fabrication of three-dimensional microstructures, cavities, and columns. Proceedings of SPIE, International Society for Optics and Photonics, 1994, 91–98

[131] Duty C, Jean D, Lackey W J. Laser chemical vapour deposition: Materials, modelling, and process control. International Materials Reviews, 2013, 271–287

[132] Wanke M C, Lehmann O, Müller K, Laser rapid prototyping of photonic band-gap microstructures. Science, 1997, 275(5304): 1284–1286

[133] Williams K L, Köhler J, Boman M. Fabrication and mechanical characterization of LCVD-deposited carbon micro-springs. Sensors and Actuators. A, Physical, 2006, 130–131: 358–364

[134] Williams K, Maxwell J, Larsson K, Freeform fabrication of functional microsolenoids, electromagnets and helical springs using high-pressure laser chemical vapor deposition. In: Proceedings of Twelfth IEEE International Conference on Micro Electro Mechanical Systems. MEMS ‘99. Orlando: IEEE, 1999, 232–237

[135] Stuke M, Mueller K, Mueller T, Laser-direct-write creation of three-dimensional OREST microcages for contact-free trapping, handling and transfer of small polarizable neutral objects in solution. Applied Physics. A, Materials Science & Processing, 2005, 81(5): 915–922

[136] van de Burgt Y B. Laser-assisted growth of carbon nanotubes. Dissertation for the Doctoral Degree. Eindhoven: Technische Universiteit Eindhoven, 2014

[137] Maeda S, Minami K, Esashi M. Excimerlaser induced CVD and its application to selective non-planar metallization. Journal of Micromechanics and Microengineering, 1995, 5(3): 237–242

[138] Williams K L. Laser-assisted CVD fabrication and characterization of carbon and tungsten microhelices for microthrusters. Dissertation for the Doctoral Degree. Sweden: Uppsala University, 2006

[139] Williams K L, Eriksson A B, Thorslund R, The electrothermal feasibility of carbon microcoil heaters for cold/hot gas microthrusters. Journal of Micromechanics and Microengineering, 2006, 16(7): 1154–1161

[140] Williams K L, Köhler J, Boman M. Fabrication and mechanical characterization of LCVD-deposited carbon micro-springs. Sensors and Actuators: A, Physical, 2006, 130–131: 358–364

[141] Lehmann O, Stuke M. Laser-driven movement of three-dimensional microstructures generated by laser rapid prototyping. Science, 1995, 270(5242): 1644–1645

[142] Holmes A S. Laser fabrication and assembly processes for MEMS. Proceedings of the SPIE, Laser Applications in Microelectronic and Optoelectronic Manufacturing VI, 2001, 4274: 297–306

[143] Fuller S B, Wilhelm E J, Jacobson J M. Ink-jet printed nanoparticle microelectromechanical systems. Journal of Microelectromechanical Systems, 2002, 11(1): 54–60

[144] O’Donnell J, Kim M, Yoon H S. A review on electromechanical devices fabricated by additive manufacturing. Journal of Manufacturing Science and Engineering, 2016, 139(1): 010801

[145] Brown T D, Dalton P D, Hutmacher D W. Direct writing by way of melt electrospinning. Advanced Materials, 2011, 23(47): 5651–5657

[146] Wu S Y, Yang C, Hsu W, 3D-printed microelectronics for integrated circuitry and passive wireless sensors. Microsystems & Nanoengineering, 2015, 1: 15013

[147] Pabst O, Perelaer J, Beckert E, All inkjet-printed piezoelectric polymer actuators: Characterization and applications for micropumps in lab-on-a-chip systems. Organic Electronics, 2013, 14(12): 3423–3429

[148] Sun K, Wei T S, Ahn B Y, 3D Printing of interdigitated Li-ion microbattery architectures. Advanced Materials, 2013, 25(33): 4539–4543

[149] Raney J R, Lewis J A. Printing mesoscale architectures. MRS Bulletin, 2015, 40(11): 943–950

[150] Compton B G, Lewis J A. 3D-printing of lightweight cellular composites. Advanced Materials, 2014, 26(34): 5930–5935

[151] Lind J U, Busbee T A, Valentine A D, Instrumented cardiac microphysiological devices via multimaterial three-dimensional printing. Nature Materials, 2016, 16(3): 303–308

[152] Skylar-Scott M A, Gunasekaran S, Lewis J A. Laser-assisted direct ink writing of planar and 3D metal architectures. Proceedings of the National Academy of Sciences of the United States of America, 2016, 113(22): 6137–6142

[153] Travitzky N, Bonet A, Dermeik B, Additive manufacturing of ceramic-based materials. Advanced Engineering Materials, 2014, 16(6): 729–754

[154] Mason M S, Huang T, Landers R G, Aqueous-based extrusion of high solids loading ceramic pastes: Process modeling and control. Journal of Materials Processing Technology, 2009, 209(6): 2946–2957

[155] Huang Y, Bu N, Duan Y, Electrohydrodynamic direct-writing. Nanoscale, 2013, 5(24): 12007–12017

[156] Onses M S, Sutanto E, Ferreira P M, Mechanisms, capabilities, and applications of high-resolution electrohydrodynamic jet printing. Small, 2015, 11(34): 4237–4266

[157] Luo G, Teh K S, Liu Y, Direct-write, self-aligned electrospinning on paper for controllable fabrication of three-dimensional structures. ACS Applied Materials & Interfaces, 2015, 7(50): 27765–27770

[158] Luo G, Teh K S, Zang X, High aspect-ratio 3D microstructures via near-field electrospinning for energy storage applications. In: Proceedings of IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS). Shanghai: IEEE, 2016, 29–32

[159] Hoey J M, Lutfurakhmanov A, Schulz D L, A review on aerosol-based direct-write and its applications for microelectronics. Journal of Nanotechnology, 2012, 2012(2012): 324380

[160] Lessing J, Glavan A C, Walker S B, Inkjet printing of conductive inks with high lateral resolution on omniphobic “RF paper” for paper-based electronics and MEMS. Advanced Materials, 2014, 26(27): 4677–4682

[161] Waheed S, Cabot J M, Macdonald N P, 3D printed microfluidic devices: Enablers and barriers. Lab on a Chip, 2016, 16(11): 1993–2013

[162] Sochol R D, Sweet E, Glick C C, 3D printed microfluidic circuitry via multijet-based additive manufacturing. Lab on a Chip, 2016, 16(4): 668–678

[163] Ko S H, Pan H, Grigoropoulos C P, All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles. Nanotechnology, 2007, 18(34): 345202

[164] Lee K J, Jun B H, Kim T H, Direct synthesis and inkjetting of silver nanocrystals toward printed electronics. Nanotechnology, 2006, 17(9): 2424–2428

[165] Ko S H, Chung J, Hotz N, Metal nanoparticle direct inkjet printing for low-temperature 3D micro metal structure fabrication. Journal of Micromechanics and Microengineering, 2010, 20(12): 125010

[166] Kong Y L, Tamargo I A, Kim H, 3D printed quantum dot light-emitting diodes. Nano Letters, 2014, 14(12): 7017–7023

[167] EcoPlex Inc. 2017. Retrieved from2017-3-10

[168] Zhang Y, Liu C, Whalley D. Direct-write techniques for maskless production of microelectronics: A review of current state-of-the-art technologies. In: Proceedings of International Conference on Electronic Packaging Technology & High Density Packaging. ICEPT-HDP ‘09. Beijing: IEEE, 2009, 497–503

[169] Optomec Aerosol Jet Printer. 2017. Retrieved from Optomec website, 2017-5-21

[170] Mette A, Richter P L, Hörteis M, Metal aerosol jet printing for solar cell metallization. Progress in Photovoltaics: Research and Applications, 2007, 15(7): 621–627

[171] Yang C, Zhou E, Miyanishi S, Preparation of active layers in polymer solar cells by aerosol jet printing. ACS Applied Materials & Interfaces, 2011, 3(10): 4053–4058

[172] Macdonald E, Salas R, Espalin D, 3D printing for the rapid prototyping of structural electronics. IEEE Access: Practical Innovations, Open Solutions, 2014, 2: 234–242

[173] Andò B, Baglio S, La Malfa S, All inkjet printed system for strain measurement. Sensors, 2012, 25(35): 215–217

[174] Rahman T, Renaud L, Heo D, Aerosol based direct-write micro-additive fabrication method for sub-mm 3D metal-dielectric structures. Journal of Micromechanics and Microengineering, 2015, 25(10): 107002

[175] Numan-Al-Mobin A M, Shankar R, Cross W M, Direct-write printing of an RF-MEMS cantilever. In: Proceedings of IEEE Antennas and Propagation Society International Symposium (APSURSI). Memphis: IEEE, 2014, 15–16

[176] Sachs E, Cima M, Williams P, Three dimensional printing: Rapid tooling and prototypes directly from a CAD model. Journal of Engineering for Industry, 1992, 114(4): 481–488

[177] Ainsley C, Reis N, Derby B. Freeform fabrication by controlled droplet deposition of powder filled melts. Journal of Materials Science, 2002, 37(15): 3155–3161

[178] Chua C K, Leong K F, Lim C S. Rapid Prototyping: Principles and Applications. 3rd ed. Singapore: World Scientific Publishing Co. Pte. Ltd., 2010

[179] Guo D, Wu X, Lei J, Fabrication of micro/nanoelectrode using focused-ion-beam chemical vapor deposition, and its application to micro-ECDM. Procedia CIRP, 2016, 42: 733–736

[180] Hon K K, Li L, Hutchings I M. Direct writing technology—Advances and developments. CIRP Annals-Manufacturing Technology, 2008, 57(2): 601–620

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