Single-chip 3D electric field microsensor

Biyun LING , Yu WANG , Chunrong PENG , Bing LI , Zhaozhi CHU , Bin LI , Shanhong XIA

Front. Mech. Eng. ›› 2017, Vol. 12 ›› Issue (4) : 581 -590.

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Front. Mech. Eng. ›› 2017, Vol. 12 ›› Issue (4) : 581 -590. DOI: 10.1007/s11465-017-0454-x
RESEARCH ARTICLE
RESEARCH ARTICLE

Single-chip 3D electric field microsensor

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Abstract

This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0–50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measurement errors of the three electrostatic field components are less than 14.04%.

Keywords

electric field microsensor / three-dimensional / single-chip / in-plane rotation

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Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA. Single-chip 3D electric field microsensor. Front. Mech. Eng., 2017, 12(4): 581-590 DOI:10.1007/s11465-017-0454-x

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The Author(s) 2017. This article is published with open access at link.springer.com and journal.hep.com.cn

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