Single-chip 3D electric field microsensor
Biyun LING , Yu WANG , Chunrong PENG , Bing LI , Zhaozhi CHU , Bin LI , Shanhong XIA
Front. Mech. Eng. ›› 2017, Vol. 12 ›› Issue (4) : 581 -590.
Single-chip 3D electric field microsensor
This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0–50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measurement errors of the three electrostatic field components are less than 14.04%.
electric field microsensor / three-dimensional / single-chip / in-plane rotation
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| [6] |
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| [7] |
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| [8] |
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| [9] |
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| [10] |
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| [11] |
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| [12] |
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| [13] |
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| [14] |
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| [15] |
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| [16] |
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| [17] |
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| [18] |
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| [19] |
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| [20] |
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| [21] |
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| [22] |
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| [23] |
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| [24] |
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| [25] |
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| [26] |
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The Author(s) 2017. This article is published with open access at link.springer.com and journal.hep.com.cn
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