Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit (IC) manufacturing process

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Front. Mech. Eng. ›› 2015, Vol. 10 ›› Issue (1) : 1-6. DOI: 10.1007/s11465-015-0325-2
RESEARCH ARTICLE

Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit (IC) manufacturing process

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{{article.zuoZheEn_L}}. {{article.titleEn}}. Front. Mech. Eng., 2015, 10(1): 1‒6 https://doi.org/10.1007/s11465-015-0325-2

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