Effect of extrusion temperature on the physical properties of high-silicon aluminum alloy

Abstract

Light-weight high-silicon aluminum alloys are used for electronic packaging in the aviation and space-flight industry. Al-30Si and Al-40Si are fabricated with air-atomization and vacuum-canning hot-extrusion process. The density, thermal conductivity, hermeticity and thermal expansion coefficients of the material are measured, and the relationship between extrusion temperature and properties is obtained. Experimental results show that the density of high-silicon aluminum alloys prepared with this method is as high as 99.64% of the theory density, and increases with elevating extrusion temperature. At the same time, thermal conductivity varies between 104-140 W/(m " K); with the extrusion temperature, thermal expansion coefficient also increases but within 13?10^-6 (at 100?C) and hermeticity of the material is high to 10^-9 order of magnitude.

Keywords

rapid solidification, vacuum canning, hot extrusion, Al-Si alloy, hermeticity, thermal conductivity, electronic package