DC characteristics of lattice-matched InAlN/AlN/GaN high electron mobility transistors
Sheng Xie , Zhihong Feng , Bo Liu , Shaobo Dun , Luhong Mao , Shilin Zhang
Transactions of Tianjin University ›› 2013, Vol. 19 ›› Issue (1) : 43 -46.
DC characteristics of lattice-matched InAlN/AlN/GaN high electron mobility transistors
Lattice-matched InAlN/AlN/GaN high electron mobility transistors (HEMTs) grown on sapphire substrate by using low-pressure metallorganic chemical vapor deposition were prepared, and the comprehensive DC characteristics were implemented by Keithley 4200 Semiconductor Characterization System. The experimental results indicated that a maximum drain current over 400 mA/mm and a peak external transconductance of 215 mS/mm can be achieved in the initial HEMTs. However, after the devices endured a 10-h thermal aging in furnace under nitrogen condition at 300 °C, the maximum reduction of saturation drain current and external transconductance at high gate-source voltage and drain-source voltage were 30% and 35%, respectively. Additionally, an increased drain-source leakage current was observed at three-terminal off-state. It was inferred that the degradation was mainly related to electron-trapping defects in the InAlN barrier layer.
indium aluminum nitride / gallium nitride / sapphire / metallorganic chemical vapor deposition / high electron mobility transistor / DC characteristic / thermal aging
| [1] |
|
| [2] |
|
| [3] |
|
| [4] |
Medjdoub F, Carlin J F, Gonschorek M et al. Can InAlN/GaN be an alternative to high power/high temperature AlGaN/GaN devices? [C]. In: International Electron Devices Meeting. San Francisco, USA, 2006. |
| [5] |
Wang Han, Chung Jinwook W, Gao Xiang et al. High performance InAlN/GaN HEMTs on SiC substrate[C]. In: CS MANTECH Conference. Portland, USA, 2010. |
| [6] |
|
| [7] |
|
| [8] |
|
| [9] |
|
| [10] |
|
| [11] |
|
| [12] |
Xie Sheng, Feng Zhihong, Zhang Shilin et al. DC characteristics of large gate periphery InAlN/GaN HEMT on sapphire substrate[C]. In: International Conference of Electron Devices and Solid-State Circuits. Tianjin, China, 2011. |
| [13] |
|
| [14] |
|
| [15] |
|
| [16] |
|
/
| 〈 |
|
〉 |