We further investigated the amount of sulfur addition during hard-bake at 600°C. Figure 3 showed the top-view and cross-sectional SEM images of Cu
2SnS
3 film baked at 600°C with the addition of 0, 1 and 10 mg sulfur powder. The amount of sulfur addition, or equivalently the sulfur vapor pressure, had little influence on the film thickness because for all three samples, Cu
2SnS
3 film was 1.0-1.3 μm thick. However, sulfur addition played a paramount effect on film morphology. When no sulfur presented, film was compact and the grain size was large. Unfortunately, there was a thin fluffy layer on top, in addition to some scattered points which were believed to be secondary phases. Energy dispersive X-ray analysis of Cu
2SnS
3 film surface observed more sulfur than its stoichiometric value. When 10 mg sulfur was introduced, the film was very porous containing many pores, and the grain size was not satisfactory. When 1 mg sulfur was presented, the film was crack-, pinhole- and secondary phase-free from the top view SEM observation, and the grains were large and compact from cross-sectional SEM observation. Such a high quality Cu
2SnS
3 is comparable to the state-of-art CZTS film [12] and paves its way for film characterization and device application. Sulfur pressure governed the delicate equilibrium between possible Cu
2SnS
3 decomposition, SnS and SnS
2 evaporation, and grain sintering and growth, probably in a similar fashion as in the CZTS system [
18]. The detailed underlying mechanism is a subject for further investigation.