PERSPECTIVE

Co-packaged optics (CPO): status, challenges, and solutions

  • Min Tan , 1,2 ,
  • Jiang Xu , 3,4,5 ,
  • Siyang Liu 6 ,
  • Junbo Feng , 6 ,
  • Hua Zhang , 7 ,
  • Chaonan Yao 7 ,
  • Shixi Chen 3 ,
  • Hangyu Guo 8 ,
  • Gengshi Han 8 ,
  • Zhanhao Wen 8 ,
  • Bao Chen 8 ,
  • Yu He 8 ,
  • Xuqiang Zheng , 8 ,
  • Da Ming 1 ,
  • Yaowen Tu 1 ,
  • Qiang Fu 1 ,
  • Nan Qi 9 ,
  • Dan Li , 10 ,
  • Li Geng 10 ,
  • Song Wen 8 ,
  • Fenghe Yang 11 ,
  • Huimin He 8 ,
  • Fengman Liu 8 ,
  • Haiyun Xue , 8 ,
  • Yuhang Wang 1 ,
  • Ciyuan Qiu , 12 ,
  • Guangcan Mi 13 ,
  • Yanbo Li 13 ,
  • Tianhai Chang , 13 ,
  • Mingche Lai 14 ,
  • Luo Zhang , 14 ,
  • Qinfen Hao , 15 ,
  • Mengyuan Qin 15
Expand
  • 1. School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, China
  • 2. Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China
  • 3. Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
  • 4. HKUST Fok Ying Tung Research Institute, Guangzhou 511462, China
  • 5. The Hong Kong University of Science and Technology(Guangzhou), Guangzhou 511462, China
  • 6. Chongqing United Micro-Electronics Center(CUMEC), Chongqing 401332, China
  • 7. Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao 266000, China
  • 8. Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China
  • 9. State Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
  • 10. School of Microelectronics, Xi'an Jiaotong University, Xi'an 710049, China
  • 11. Zhangjiang Laboratory, Shanghai 201210, China
  • 12. The State Key Laboratory of Advanced Optical Communication Systems and Networks, Department of Electronic Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
  • 13. Huawei Technologies Co., Ltd., Shenzhen 440307, China
  • 14. College of Computer, National University of Defense Technology, Changsha 410073, China
  • 15. Institute of Computing Technology, Chinese Academy of Sciences, Beijing 100086, China
mtan@hust.edu.cn
jiang.xu@ust.hk
junbo.feng@cumec.cn
zhanghua8@hisense.com
zhengxuqiang@ime.ac.cn
dan.li@xjtu.edu.cn
xuehaiyun@ime.ac.cn
qiuciyuan@sjtu.edu.cn
changtianhai@huawei.com
jiiftluo@nudt.edu.cn
haoqinfen@ict.ac.cn

Received date: 09 Jun 2022

Accepted date: 22 Aug 2022

Published date: 15 Mar 2023

Copyright

2023 The Author(s)

Abstract

Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slower rate than that of datacenter traffic. The gap between application requirements and the capability of conventional pluggable optics keeps increasing, a trend that is unsustainable. Copackaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. CPO is widely regarded as a promising solution for future datacenter interconnections, and silicon platform is the most promising platform for large-scale integration. Leading international companies (e.g., Intel, Broadcom and IBM) have heavily investigated in CPO technology, an inter-disciplinary research field that involves photonic devices, integrated circuits design, packaging, photonic device modeling, electronic-photonic co-simulation, applications, and standardization. This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform, identify the key challenges, and point out the potential solutions, hoping to encourage collaboration between different research fields to accelerate the development of CPO technology.

Cite this article

Min Tan , Jiang Xu , Siyang Liu , Junbo Feng , Hua Zhang , Chaonan Yao , Shixi Chen , Hangyu Guo , Gengshi Han , Zhanhao Wen , Bao Chen , Yu He , Xuqiang Zheng , Da Ming , Yaowen Tu , Qiang Fu , Nan Qi , Dan Li , Li Geng , Song Wen , Fenghe Yang , Huimin He , Fengman Liu , Haiyun Xue , Yuhang Wang , Ciyuan Qiu , Guangcan Mi , Yanbo Li , Tianhai Chang , Mingche Lai , Luo Zhang , Qinfen Hao , Mengyuan Qin . Co-packaged optics (CPO): status, challenges, and solutions[J]. Frontiers of Optoelectronics, 2023 , 16(1) : 1 . DOI: 10.1007/s12200-022-00055-y

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