Frontiers of Optoelectronics >

2010 , Vol. 3 >Issue 2: 139 - 142

DOI: https://doi.org/10.1007/s12200-010-0009-9

Research articles

Nano materials for microelectronic and photonic packaging

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  • School of Materials Science and Engineering, Microsystems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA;

Published date: 05 Jun 2010

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Abstract

This paper addresses the state-of-the-art nano-science and technology regarding next generation high density microelectronics and photonics packaging applications, including carbon nanotubes (CNTs) for electrical/thermal devices, and molecular wires for electrical interconnects, etc.

Cite this article

Ching-Ping WONG, Wei LIN, Ling-Bo ZHU, Hong-Jin JIANG, Rong-Wei ZHANG, Yi LI, Kyoung-Sik MOON, . Nano materials for microelectronic and photonic packaging[J]. Frontiers of Optoelectronics, 2010 , 3(2) : 139 -142 . DOI: 10.1007/s12200-010-0009-9

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