Nano materials for microelectronic and photonic
packaging

doi:10.1007/s12200-010-0009-9

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Front. Optoelectron. ›› 2010, Vol. 3 ›› Issue (2) : 139-142. DOI: 10.1007/s12200-010-0009-9

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Nano materials for microelectronic and photonic packaging

Ching-Ping WONG,Wei LIN,Ling-Bo ZHU,Hong-Jin JIANG,Rong-Wei ZHANG,Yi LI,Kyoung-Sik MOON,

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Abstract

This paper addresses the state-of-the-art nano-science and technology regarding next generation high density microelectronics and photonics packaging applications, including carbon nanotubes (CNTs) for electrical/thermal devices, and molecular wires for electrical interconnects, etc.

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Ching-Ping WONG, Wei LIN, Ling-Bo ZHU, Hong-Jin JIANG, Rong-Wei ZHANG, Yi LI, Kyoung-Sik MOON,. Nano materials for microelectronic and photonic packaging. Front. Optoelectron., 2010, 3(2): 139‒142 https://doi.org/10.1007/s12200-010-0009-9