1 Introduction
2 The PRISM framework
2.1 Product performance and relevant physicochemical phenomena
Tab.1 Intended functions, desired performance, relevant physicochemical phenomena, and ingredients information of structural products |
Product | Intended (main) function | Desired performance | Relevant physicochemical phenomena | Types of ingredients | |
---|---|---|---|---|---|
Key ingredients | Supporting ingredients | ||||
DAA [29] | Provides heat management | Enhanced heat transfer | Heat conduction | Filler Polymer matrix | Solvent |
Nanodielectrics [30] | Resists the flow of electric charges through a material | Enhanced dielectric properties | Electrostatics | Filler Polymer matrix | Dispersing agent Solvent |
Mosquito repellent mat [31] | Stores the repellent solution and releases it to air when being heated | Controlled diffusion | Mass transfer (diffusion) | Active ingredient Solvent Propellant | Fragrance Emollients |
Sound absorption foam [32] | Absorbs noise from the environment | High sound absorption | Acoustics absorption | Polymer matrix Foaming agent | Surfactant |
Thermal barrier coating [33] | Protects the metallic component from heat | High heat resistance | Heat conduction/ convection | Coating material Substrate | − |
Solar cell encapsulant film [34] | Provides electrical insulation and heat management | Electrical resistance and enhanced heat transfer | Electrical conduction Heat conduction | Filler Polymer matrix | Coupling agent Solvent |
Electromagnetic interference (EMI) shield [35] | Adsorbs and reflects electromagnetic waves | EMI shielding effectiveness | Electromagnetics | Filler Polymer matrix | Solvent |
Piezoresistive sensor [36] | Changes electrical resistivity when compressed or strained | High Piezoresistive sensitivity (gauge factor) | Electrical conduction Elasticity | Filler Polymer matrix | Solvent |
2.2 Ingredients and physicochemical properties
2.3 Product structure
Tab.2 Different levels of product structure |
Product structure | Structure representation/categorization | Descriptions |
---|---|---|
Product form | Solid | Composite, tablet, encapsulate, powder, granules, film |
Semi-solid | Paste, cream | |
Liquid | Emulsion, liquid foam, suspension, mixture | |
Gas | Aerosol | |
Macrostructure | Composition | No. of phases, volume fraction |
Phase distribution/arrangement | Dispersed, porous, segregated, patterned (honeycomb, lamellar, layered, onion) | |
Microstructure | Phase fraction | Local volume fraction |
Phase distribution/arrangement | Local dispersion (orientation, distance between the inclusions) | |
Shape of inclusion | Sphere, needle, cubic, disk, rod, fiber | |
Size of inclusion | Micro, nano | |
Interfacial interaction | Interfacial layer | |
Crystallinity | Single crystalline, polycrystalline, amorphous | |
Porosity | Pore size |
Tab.3 Common macrostructures in structural products |
Macrostructure | Description | Examples of products |
---|---|---|
Dispersed | One phase is dispersed in a continuous phase | DAA nanodielectrics |
Porous | Presence of pores within a structure | Mosquito repellent mat Sound absorption foam |
Lamellar | A structure composed of thin, flat, and interchanging lamellae of different materials | Thermal barrier coating Solar cell encapsulant film |
Segregated | One phase forms a continuous network in the structure | EMI shield Piezoresistive sensor |
Tab.4 Key microstructural features of composite material |
Microstructural features | Examples of microstructural features parameters | Graphical representation | |
---|---|---|---|
Phase fraction | Weight fraction, volume fraction | ‒ | |
Shape of inclusion | Aspect ratio, roundedness, rectangularity | Particulate | Fibrous |
Size of inclusion | Equivalent diameter, particle size distribution | Microparticles | Nanoparticles |
Phase distribution | Average nearest center/surface distance between inclusion (interconnectivity), orientation | Preferred orientation | Interconnected |
Interfacial interaction | Thickness of interfacial layer | ‒ |
2.4 Analytical models
Tab.5 Analytical models for predicting the effective properties of two-phase structural products [47] |
Models | Expressions a) |
---|---|
Parallel model | |
Series model | |
Effective medium theory (EMT) model | |
Maxwell model | |
Hamilton model | |
Reciprocity model |
a) = property ratio, n = shape factor of the dispersed phase. |
2.5 Computation-driven framework/methods/techniques
2.5.1 Correlation function (CF)-based reconstruction
2.5.2 Physical descriptors-based reconstruction
2.5.3 Machine learning (ML)
2.5.4 Microstructure design optimization
2.6 Manufacturing process design
Tab.6 Structure-processing-property relationship in CPC [79] |
Product structure | Processing routes | Property and resultant structure a) | |||
---|---|---|---|---|---|
Macro-structure | Microstructural features | Key processing techniques | Equipment design | Operating conditions | |
Segregated | Volume fraction, size and shape of inclusion, interconnectivity | Mechanical grinding, Hot pressing | Dimensions of mechanical grinder, and its blade design | Time and speed of grinding, time, temperature and pressure for hot pressing | Thermal conductivity= 0.37 W∙m–1∙K–1 |
Melt mixing Hot pressing | Dimensions of the mixer, and its mixing blade design | Time, temperature and mechanical power of mixing time, temperature and pressure for pressing | Thermal conductivity= 0.30 W∙m–1∙K–1 |
a) Yellow dots represent the distribution of AlN in the polymer network. |
3 Examples
3.1 Nanodielectrics
3.1.1 Product performance and relevant physicochemical phenomena
3.1.2 Ingredients and physicochemical properties
3.1.3 Product structure
3.1.4 Analytical models
3.1.5 Computation-driven framework/methods/techniques
3.1.6 Manufacturing process design
Tab.7 Processing techniques, equipment and process parameters for the manufacture of nanodielectrics |
Processing techniques | Equipment | Functions | Process parameters |
---|---|---|---|
Sonication | Ultrasonicator | Disperse nanoparticles, surface modification of nanoparticles to prevent agglomeration | Sonic power, time |
Mixing | Shear mixer | Disperse the silica nanoparticles in epoxy, control particle size | Mechanical speed, time |
Drying | Vacuum oven | Remove solvent and coupling agent | Temperature, time |
Mixing | Shear mixer | Mix the curing agent with the polymer mixture | Mechanical speed, time |
Degassing | Vacuum desiccator | Remove air bubbles and moisture | Time |
Casting and curing | Pre-defined mold oven | Form the solid composite | Temperature, time |
3.2 Die attach adhesive
3.2.1 Product performance and relevant physicochemical phenomena
3.2.2 Ingredients and physicochemical properties
3.2.3 Product structure
3.2.4 Analytical models
3.2.5 Computation-driven framework/methods/techniques
3.2.6 Manufacturing process design
Tab.8 Processing techniques, equipment and process parameters for the manufacturing of DAA |
Processing techniques | Equipment | Functions | Process parameters |
---|---|---|---|
Mixing | Mechanical stirrer | Mix the particles with epoxy | Mechanical speed, time |
Homogenization | Homogenizer | Disperse fillers in the polymer matrix | Mechanical speed, time |
Sonication | Ultrasonicator | Disperse fillers in the polymer matrix | Sonic power, time |
Drying | Oven | Remove solvent | Temperature, time |
Mixing | Mixer | Mix the curing agent with the polymer mixture | Mechanical speed, time |
Molding and curing | Pre-defined mold oven | Form the solid composite | Temperature, time |