Micro-holes with high aspect ratios fabricated on metallic targets are highly demanded in engine manufacturing, biomedical applications, and other practical fields. Electrical discharge machining [
1], electrochemical machining [
2], and laser machining [
3] are major prevailing methods for metal hole drilling. Among these methods, femtosecond laser drilling has its unique advantages. The femtosecond laser can accomplish energy deposition before the establishment of the electron-phonon thermodynamic equilibrium and therefore achieve fewer thermal defects, smaller heat-affected zone, and higher fabrication precision [
4,
5] than long-pulse laser fabrication. Accompanied with magnetic field, femtosecond laser could also fabricate some high aspect-ratio micro-structures for dynamic modulation of optical and mechanical properties of textured surfaces [
6,
7]. Moreover, femtosecond laser with peak power larger than the critical power
Pcr for self-focusing may undergo the subtle balancing among the Kerr effect induced self-focusing, the plasma-induced defocusing and the propagation induced diffraction, forming a plasma channel called laser filament [
8]. Laser filament is a plasma channel with a high optical intensity of ~10
13 W/cm
2 [
9,
10], sustaining orders of magnitude longer than the Rayleigh length, which suggests that a filament is a competent tool for high aspect ratio hole drilling [
11,
12]. Bessel and Bessel-like beam with long focal range generated by the axicon and axilens are potent tools used for deep hole drilling [
13–
15], while the processing target needs to be transparent at the laser’s wavelength so that the sidelobes can penetrate through the target to form a long focal-length beam. Contrastingly, the femtosecond filament sustained by the dynamic balance among the Kerr effect induced self-focusing, the plasma’s defocusing, and the beam diffraction in the paraxial region would be an effective method for deep hole drilling in opaque materials.