Ceramic-metal package for high power LED lighting

Yu Jin HEO, Hyo Tae KIM, Sahn NAHM, Jihoon KIM, Young Joon YOON, Jonghee KIM

PDF(337 KB)
PDF(337 KB)
Front. Optoelectron. ›› 2012, Vol. 5 ›› Issue (2) : 133-137. DOI: 10.1007/s12200-012-0252-3
RESEARCH ARTICLE
RESEARCH ARTICLE

Ceramic-metal package for high power LED lighting

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Abstract

High power light-emitting diodes (LEDs) lighting has drawn a great interest in the field of street light system in recent years. Key parameters for successful launching of LED street light in the commercial market are price and light efficiency, respectively, and they are greatly influenced by the materials and design factors used in high power LED package. This article presents a new design and materials processing technology to realize the solution of LED packaging with advantageous in price and performance. Cost effective materials and processing technology can be realized via thick film glass-ceramic insulating layer and silver conductor. Highly effective thermal design using direct heat dissipation to heat sink in LED package is demonstrated.

Keywords

light-emitting diodes (LEDs) package / high-power / thick film / heat dissipation / thermal resistance

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Yu Jin HEO, Hyo Tae KIM, Sahn NAHM, Jihoon KIM, Young Joon YOON, Jonghee KIM. Ceramic-metal package for high power LED lighting. Front Optoelec, 2012, 5(2): 133‒137 https://doi.org/10.1007/s12200-012-0252-3

References

[1]
Philips. White Paper: Street Lighting. www.lumileds.com
[2]
Liu S, Luo X B. LED Packaging for Lighting Applications: Design, Manufacturing and Testing. New York: Wiley and Chemical Industry Press, 2011
[3]
Mottier P. LEDs for Lighting Applications. New York: Wiley, 2008
[4]
Shin H W, Lee H S, Bang J H, Yoo S H, Jung S B, Kim K D. Variation of thermal resistance of LED module embedded by thermal via. Journal of the Microelectronics & packaging Society, 2010, 17(4): 95–100
[5]
Arik M, Becker C, Weaver S, Petroski J. Thermal management of LEDs: package to system. Proceedings of the SPIE, 2004, 5187: 64–75
CrossRef Google scholar
[6]
Cheng T, Luo X B, Huang S Y, Liu S. Thermal analysis and optimization of multiple LED packaging based on a general analytical solution. International Journal of Thermal Sciences, 2010, 49(1): 196–201
CrossRef Google scholar
[7]
Tsai M Y, Chen C H, Kang C S. Thermal measurements and analyses of low-cost high power LED packages and their modules. Microelectronics and Reliability, 2011
CrossRef Pubmed Google scholar
[8]
Liou B H, Chen C H, Horng R H, Chiang Y C, Wuu D S. Improvement of thermal management of high-power GaN-based light-emitting diodes. Microelectronics and Reliability, 2011
CrossRef Pubmed Google scholar
[9]
Yung K C, Liem H, Choy H S, Lun W K. Thermal performance of high brightness LED array package on PCB. International Communications in Heat and Mass Transfer, 2010, 37(9): 1266–1272
CrossRef Google scholar
[10]
Weng C J. Advanced thermal enhancement and management of LED packages. International Communications in Heat and Mass Transfer, 2009, 36(3): 245–248
CrossRef Google scholar
[11]
Christensen A, Graham S. Thermal effects in packaging high power light emitting diode arrays. Applied Thermal Engineering, 2009, 29(2-3): 364–371
CrossRef Google scholar
[12]
Kim L, Choi J H, Jang S H, Shin M W. Thermal analysis of LED array system with heat pipe. Thermochimica Acta, 2007, 455(1-2): 21–25
CrossRef Google scholar
[13]
Anithambigai P, Dinash K, Mutharasu D, Shanmugan S, Lim C K. Thermal analysis of power LED employing dual interface method and water flow as a cooling system. Thermochimica Acta, 2011, 523(1-2): 237–244
CrossRef Google scholar
[14]
Sim J K, Ashok K, Ra Y H, Im H C, Baek B J, Lee C R. Characteristic enhancement of white LED lamp using low temperature co-fired ceramic-chip on board package. Current Applied Physics, 2012, 12(2): 494–498
CrossRef Google scholar
[15]
Zhou W, Qi S, Li H, Shao S. Study on insulating thermal conductive BN/HDPE composites. Thermochimica Acta, 2007, 452(1): 36–42
CrossRef Google scholar
[16]
Kang M, Kang S. Influence of Al2O3 additions on the crystallization mechanism and properties of diopside/anorthite hybrid glass-ceramics for LED packaging materials. Journal of Crystal Growth, 2011, 326(1): 124–127
CrossRef Google scholar

Acknowledgements

This work was supported by the R&D support program of the Small & Medium Business Administration (SMBA), Korea (Grant No. S1071285, 2010-2012).

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2014 Higher Education Press and Springer-Verlag Berlin Heidelberg
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