A new material removal rate model for high-shear and low-pressure grinding of single-crystal silicon considering elastohydrodynamic pressure

Abstract

A material removal mechanism is a prerequisite to maintaining high-quality surfaces for high-shear and low-pressure grinding using body-armor-like grinding wheels (BAGWs). However, the pressure distribution and material removal efficiency for machining brittle materials using BAGWs remain unclear. This research investigated two types of elastic deformations during grinding by analyzing the contact mechanism between BAGWs and the workpiece. Additionally, the model of elastohydrodynamic pressure distribution was refined, and the material removal mechanism for machining brittle materials, incorporating the maximum undeformed chip thickness, was revealed. A material removal rate (MRR) model was established based on Hertzian contact, ductile-brittle transition, and spherical indentation theory. The theoretical model was validated through single-factor experiments utilizing a high-shear and low-pressure grinding experimental platform. At a normal grinding force of 15 N and a grinding speed of 10 m/s, the MRR could reach up to 0.276 mm³/s. The experimental results revealed that the model could accurately predict the MRR under various grinding parameters, with an average prediction error of 8.5%.

Graphical abstract

Keywords

elastohydrodynamic pressure / brittle-ductile transition / material removal rate / body-armor-like grinding wheel / high-shear and low-pressure grinding

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