Review of damping composite materials and structures involving self-healing constituents

Abstract

The continuous pursuit of extremely lightweight and multi-functional integrated designs in modern industries requires that structural materials are not limited to ensuring the structural load-bearing function of lightweight designs; rather, they must have high mechanical properties and high damping capabilities. Self-healing materials are becoming popular because of their attractive repairability and reprocessability. Dynamic reversible bonds, which are included in self-healing polymer networks, have been extensively studied with respect to different chemical mechanisms. Nevertheless, the ability to reach high stiffness and high damping performance is crucial. In this review, different types of self-healing materials are introduced, and their complex and contradictory relationships with stiffness, damping, and self-healing properties are explained. This review combines intrinsic damping sources and extrinsic deformation driving modes as a holistic concept of material–structure–performance integrated design methodology to address the extensive challenges of increasing specific damping performance. Specifically, the sources of damping at the nanolevel and the deformation-driving modes at different levels of structural hierarchy are explained in depth to reveal the cross-scale coordination between intrinsic damping sources and extrinsic deformation-driven modes originating from extremely different length scales in the microstructural architecture of a material. The material–structure–performance integrated design methodology is expected to become a key strategy for the sustainable development of breakthrough and transformative damping composite structures for aerospace, terrestrial, and marine transportation.

Graphical abstract

Keywords

bio-inspired self-healing materials / mechanical properties / damping mechanisms / multiscale / structural damping composites / hierarchy

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Nomenclature

Abbreviations
AFD	Aminophenyl disulfide
AlN	Aluminum nitride
BN	Boron nitride
CAN	Covalent adaptive network
CLD	Constrained layer damping
CNT	Carbon nanotube
CTH	Close-then-heal
FLD	Free layer damping
HBE	Hyperbranched epoxy
MIM	Mechanically interlocked molecule
PE	Polyethylene
PGN	Pillared graphene nanostructures
PLA	Poly(lactic acid)
SiC	Silicon carbide

Acknowledgements

This work was supported by the National Natural Science Foundation of China (Grant No. 52175095) and the Young Top-notch Talent Cultivation Program of Hubei Province of China.

Conflict of Interest

The authors declare no conflict of interest.

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