Copper fractal growth during recycling from waste printed circuit boards by slurry electrolysis
Jiqin Wang, Xiaoxia Yi, Xiangfei Zeng, Shuyuan Chen, Rui Wang, Jiancheng Shu, Mengjun Chen, Zhengxue Xiao
Copper fractal growth during recycling from waste printed circuit boards by slurry electrolysis
• Copper fractal growth was observed during WPCBs recycling by slurry electrolysis.
• Dendrites fractal growth could be controlled by additive during electrodeposition.
• Additive was proved to be an effective way to refine the copper crystal.
• These findings contribute to enrich the study of slurry electrolysis.
Superfine copper particles could be directly prepared from waste printed circuit boards by slurry electrolysis. Meanwhile, copper fractal growth could be observed. To better understand this phenomenon, the factors that affect copper dendrites in a point-cathode system were discussed in detail. These results showed that the fractal degree of copper dendrites increased as the increase of applied voltage and the decrease of copper sulfate and gelatin concentrations. Sodium lauryl sulfate and hydrochloric acid concentrations could not significantly impact the fractal degree of copper dendrites, while gelatin concentration could. The minimum copper fractal dimension was 1.069 when gelatin and copper sulfate concentration was 120 mg/L and 0.1 mol/L, respectively with an applied voltage of 11 V. Moreover, the results diffusion-limited aggregation model demonstrated that particle translational speed, particle numbers and binding probability significantly affected copper dendrite patterns. The scanning electron microscopy results indicated that the three additives greatly affected the refinement of the copper crystal. These findings contribute to enrich the theoretical study on metals recovery from e-waste by slurry electrolysis.
Dendritic copper / Fractal growth / WPCBs / Slurry electrolysis
[1] |
Arafat Y, Sultana S T, Dutta I, Panat R (2018). Effect of additives on the microstructure of electroplated tin films. Journal of the Electrochemical Society, 165(16): D816–D824
CrossRef
Google scholar
|
[2] |
Benoit B M (1983). The Fractal Geometry of Nature. American Journal of Physics, 51(3): 286-287
CrossRef
Google scholar
|
[3] |
Brady R M, Ball R C (1984). Fractal growth of copper electrodeposits. Nature, 309(5965): 225–229
CrossRef
Google scholar
|
[4] |
Bruyn D J (1997). Physical and electrochemical contributions to the cell voltage in the thin-layer electrochemical deposition of copper at constant current. Physical Review E Statal Physics Plasmas Fluids & Related Interdiplinary Topics, 56(3):155–164
|
[5] |
Calvo G, Mudd G, Valero A, Valero A. (2016). Decreasing ore grades in global metallic mining: A theoretical issue or a global reality? Resources, 5(4): 36
CrossRef
Google scholar
|
[6] |
Chang T, Jin Y, Wen L, Zhang C, Leygraf C, Wallinder I O, Zhang J (2016). Synergistic effects of gelatin and convection on copper foil electrodeposition. Electrochimica Acta, 211: 245–254
CrossRef
Google scholar
|
[7] |
Chen M, Huang J, Ogunseitan O A, Zhu N, Wang Y M (2015). Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids. Waste Management (New York, N.Y.), 41: 142–147
CrossRef
Google scholar
|
[8] |
Costa J M, Sagues F, Vilarrasa M (1991). Growth rate of fractal copper electrodeposits: Potential and concentration effects. Physical Review A., 43(12): 7057–7060
CrossRef
Google scholar
|
[9] |
Djaghout I, Affoune A M, Chelaghmia M L, Bendjaballah M (2015). Experimental investigation of nickel electrodeposits brightness in the presence of surfactants: Modeling, optimization and polarization studies. Portugaliae Electrochimica Acta, 33(4): 209–222
CrossRef
Google scholar
|
[10] |
Faraji F, Golmohammadzadeh R, Rashchi F, Alimardani N (2018). Fungal bioleaching of WPCBs using Aspergillus niger: Observation, optimization and kinetics. Journal of Environmental Management, 217: 775–787
CrossRef
Google scholar
|
[11] |
Hara A, Kazimierczak H, Bigos A, Witek Z, Ozga P (2019). Effect of different organic additives on surface morphology and microstructure of Zn-Mo coatings electrodeposited from citrate baths. Archives of Metallurgy and Materials, 64(1): 207–220
|
[12] |
Hung P K, Huang C H, Houng M P (2014). Enhancing the performance of electrodeposited CuInSe2 solar cells by suppressing secondary phases using sodium dodecyl sulfate. Journal of Materials Science Materials in Electronics, 25(4): 1848–1855
CrossRef
Google scholar
|
[13] |
Ibrahim H, Farah H, Zein Eddin A, Isber S, Sultan R (2017). Ag fractal structures in electroless metal deposition systems with and without magnetic field. Chaos (Woodbury, N.Y.), 27(8): 083111
CrossRef
Google scholar
|
[14] |
Julukian A, Raaen S, Franke D (2014). Formation of dendritic Pt nanostructures on graphite. Journal of Vacuum Science & Technology B, 32(3): 031803–031803–031805
|
[15] |
Koca M B, Gümüşgöz Çelik G, Kardaş G, Yazıcı B (2019). NiGa modified carbon-felt cathode for hydrogen production. International Journal of Hydrogen Energy, 44(27): 14157–14163
CrossRef
Google scholar
|
[16] |
Li F, Chen M, Shu J, Shirvani M, Li Y, Sun Z, Sun S, Xu Z, Fu K, Chen S (2019). Copper and gold recovery from CPU sockets by one-step slurry electrolysis. Journal of Cleaner Production, 213: 673–679
CrossRef
Google scholar
|
[17] |
Luo X, Schramm D N (1992). Fractals and cosmological large-scale structure. Science, 256(5056): 513–515
CrossRef
Google scholar
|
[18] |
Matsushita M, Sano M, Hayakawa Y, Honjo H, Sawada Y (1984). Fractal structures of zinc metal leaves grown by electrodeposition. Physical Review Letters, 53(3): 286–289
CrossRef
Google scholar
|
[19] |
McGinnity J, Nicol M, Zainol Z, Ang A (2017). Development of a rapid measurement of current efficiency in the electrowinning of zinc. Hydrometallurgy, 169: 173–182
CrossRef
Google scholar
|
[20] |
Nakouzi E, Sultan R (2011). Fractal structures in two-metal electrodeposition systems I: Pb and Zn. Chaos (Woodbury, N.Y.), 21(4): 043133
CrossRef
Google scholar
|
[21] |
Nakouzi E, Sultan R (2012). Fractal structures in two-metal electrodeposition systems II: Cu and Zn. Chaos (Woodbury, N.Y.), 22(2): 023122
CrossRef
Google scholar
|
[22] |
Park S A, Kim S H, Yoo Y H, Kim J G (2015). Effect of chloride ions on the corrosion behavior of low-alloy steel containing copper and antimony in sulfuric acid solution. Metals and Materials International, 21(3): 470–478
CrossRef
Google scholar
|
[23] |
Pinho S, Ferreira M, Almeida M F (2018). A wet dismantling process for the recycling of computer printed circuit boards. Resources, Conservation and Recycling, 132: 71–76
CrossRef
Google scholar
|
[24] |
Qiu R, Lin M, Ruan J, Fu Y, Hu J, Deng M, Tang Y, Qiu R (2020). Recovering full metallic resources from waste printed circuit boards: A refined review. Journal of Cleaner Production, 244: 118690
CrossRef
Google scholar
|
[25] |
Santos N M, Santos D M F (2018). A fractal dimension minimum in electrodeposited copper dendritic patterns. Chaos, Solitons, and Fractals, 116: 381–385
CrossRef
Google scholar
|
[26] |
Sekar R, Jagadesh K K, Ramesh Bapu G N K (2015). Electrodeposition and characterisation of copper deposits from non-cyanide electrolytes. Surface Engineering, 31(6): 433–438
CrossRef
Google scholar
|
[27] |
Shimizu M, Hirahara K, Arai S (2019). Morphology control of zinc electrodeposition by surfactant addition for alkaline-based rechargeable batteries. Physical Chemistry Chemical Physics, 21(13): 7045–7052
CrossRef
Google scholar
|
[28] |
Suzuki A, Oue S, Kobayashi S, Nakano H (2017a). Effects of additives on the surface roughness and throwing power of copper deposited from electrorefining solutions. Materials Transactions, 58(11): 1538–1545
CrossRef
Google scholar
|
[29] |
Suzuki A, Oue S, Kobayashi S, Nakano H (2017b). Synergistic effect of additives on the surface roughness and throwing power of copper deposited from electrorefining solution. Materials Transactions, 58(11): 1538–1545
CrossRef
Google scholar
|
[30] |
Tan Q, Li J (2017). Manage chemicals and waste globally. Nature, 547(7662): 162
CrossRef
Google scholar
|
[31] |
Wang H, Zhang S, Li B, Pan D A, Wu Y, Zuo T (2017). Recovery of waste printed circuit boards through pyrometallurgical processing: A review. Resources, Conservation and Recycling, 126: 209–218
CrossRef
Google scholar
|
[32] |
Wang J, Xu Z (2015). Disposing and recycling waste printed circuit boards: Disconnecting, resource recovery, and pollution control. Environmental Science & Technology, 49(2): 721–733
CrossRef
Google scholar
|
[33] |
Xiu F R, Li Y, Qi Y, Yu X, He J, Lu Y, Gao X, Deng Y, Song Z (2019). A novel treatment of waste printed circuit boards by low-temperature near-critical aqueous ammonia: Debromination and preparation of nitrogen-containing fine chemicals. Waste Management (New York, N.Y.), 84: 355–363
CrossRef
Google scholar
|
[34] |
Yang D, Chu Y, Wang J, Chen M, Shu J, Xiu F, Xu Z, Sun S, Chen S (2018). Completely separating metals and nonmetals from waste printed circuit boards by slurry electrolysis. Separation and Purification Technology, 205: 302–307
CrossRef
Google scholar
|
[35] |
Zhang H, Zhang M (2008). Synthesis of CuO nanocrystalline and their application as electrode materials for capacitors. Materials Chemistry and Physics, 108(2–3): 184–187
CrossRef
Google scholar
|
[36] |
Zhang S, Li Y, Wang R, Xu Z, Wang B, Chen S, Chen M (2017). Superfine copper powders recycled from concentrated metal scraps of waste printed circuit boards by slurry electrolysis. Journal of Cleaner Production, 152: 1–6
CrossRef
Google scholar
|
[37] |
Zhang Y, Chen M, Tan Q, Wang B, Chen S (2018). Recovery of copper from WPCBs using slurry electrolysis with ionic liquid [BSO3HPy]HSO4. Hydrometallurgy, 175: 150–154
CrossRef
Google scholar
|
/
〈 | 〉 |