Deep eutectic solvent inclusions for high-k composite dielectric elastomers

Abstract

Recent advances in novel electroactive devices have placed new requirements on material development. High-performance dielectric elastomers with good mechanical stretchability and high dielectric constant are under high demand. However, the current strategy for fabricating these materials suffers from high cost or low thermal stability, which greatly hinders large-scale industrial production. Herein, we have successfully developed a novel strategy for improving the dielectric constant of polymeric elastomers via deep eutectic solvent inclusion by taking advantage of the low cost, convenient and environmentally benign synthesis process and high ionic conductivity from deep eutectic solvents. The as-prepared composite elastomers showed good stretchability and a greatly enhanced dielectric constant with a negligible increase in dielectric dissipation. Moreover, we have proven the universality of our strategy by using different types of deep eutectic solvents. It is believed that low-cost, easy-synthesis and environmentally friendly deep eutectic solvents including composite elastomers are highly suitable for large-scale industrial production and can greatly broaden the application fields of dielectric elastomers.

Graphical abstract

Keywords

composite materials / deep eutectic solvent / dielectric elastomer / high dielectric constant

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (Grant No. 22078276), the Program for Guangdong Introducing Innovative and Entrepreneurial Teams (Grant No. 2017ZT07C291), Shenzhen Science and Technology Program (Grant No. KQTD20170810141424366), Shenzhen Key Laboratory of Advanced Materials Product Engineering (Grant No. ZDSYS20190911164401990). Qi Zhang thanks the Presidential Fund (Grant No. PF01000949) for supporting his research at CUHK-Shenzhen. Dr. Yifeng Sheng is thanked for the advice on emulsion preparation. Prof. Xilin Wang and Ms. Jinfeng Peng from Tsinghua Shenzhen International Graduate School, Prof. Zhijun Dong and Ms. Lili Wu from Shenzhen Institute of Information Technology are thanked for their support in sample testing.

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