Editorial board

Editor-in-Chief
Zhiming Wang
University of Electronic Science and Technology of China, Chengdu, China


Yong Wang
University of Electronic Science and Technology of China, Chengdu, China


Associate Editors
Yanbo Li
University of Electronic Science and Technology of China, Chengdu, China

Xin Tong
University of Electronic Science and Technology of China, Chengdu, China

Honor Committee Members
Jean-Marie Lehn, Nobel Prize Winner
University of Strasbourg Institute of Advanced Study (USIAS), Strasbourg, France

Avram Hershko, Nobel Prize Winner
Technion-Israel Institute of Technology, Haifa, Israel

Advisory Committee Members
Le-Min Li
University of Electronic Science and Technology of China, Chengdu, China

Ce-Wen Nan
Tsinghua University, Beijing, China

Hong-Xing Xu
Wuhan University, Wuhan, Hubei, China

Ning-Hua Zhu
Institute of Semiconductors, CAS, Beijing, China

Committee Members
Chin-Chen Chang
Feng Chia University, Taichung, China

Kin Seng Chiang
City University of Hong Kong, Hong Kong, China

Charles M. Falco
The University of Arizona, Tucson, USA

Avraham Freedman
Nice Systems, Ra'anana, Israel

Shuzhi Sam Ge
The National University of Singapore, Singapore

Min-Shiang Hwang
Asia University, Taichung, China

Jian-Jun Jiang
Huazhong University of Science & Technology, Wuhan, China

Bernard Kippelen
Georgia Institute of Technology, Atlanta, USA

Qing-Huo Liu
Duke University, Durham, USA

Yun Liu
Beijing Jiaotong University, Beijing, China

Chuang Qin
University of Shanghai for Science & Technology, Shanghai, China

Zhi-Guang Qin
University of Electronic Science & Technology of China, Chengdu, China

Habib F. Rashvand
University of Warwick, Coventry, UK

Giuseppe Ricci
University of Salento, Lecce, Italy

Axel Sikora
Offenburg University of Applied Sciences, Offenburg, Germany

Hai-Zhi Song
University of Electronic Science & Technology of China, Chengdu, China

Danny Sutanto
University of Wollongong, Wollongong, Australia

Stephanie Teufel
University of Fribourg, Fribourg, Switzerland

Hou-Jun Wang
University of Electronic Science & Technology of China, Chengdu, China

Jun Wang
The Chinese University of Hong Kong, Hong Kong, China

Xiao-Fan Wang
Shanghai Jiao Tong University, Shanghai, China

Michal Wozniak
Wrocsaw University of Technology, Wrocsaw, Poland

Qiang Xiao
University of Delaware, Newark, USA

Gary G. Yen
Oklahoma State University, Stillwater, USA

Yi-Xian Yang
Beijing Univ. of Posts & Telecom., Beijing, China

Pubdate: 2024-07-02    Viewed: 82