Influence of microstructures on thermal fatigue property of a nickel-base superalloy

Peng-Cheng XIA, Feng-Wen CHEN, Kun XIE, Ling QIAO, Jin-Jiang YU

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PDF(1887 KB)
Front. Mater. Sci. ›› 2015, Vol. 9 ›› Issue (1) : 85-92. DOI: 10.1007/s11706-015-0277-9
RESEARCH ARTICLE
RESEARCH ARTICLE

Influence of microstructures on thermal fatigue property of a nickel-base superalloy

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Abstract

Effect of microstructures such as the distribution and shape of carbide and γ′ phase on thermal fatigue property of a superalloy was investigated experimentally. The resistance of thermal fatigue of the studied alloy decreases with the rising upper temperature. For the as-cast alloy, the thermal fatigue crack mostly origins from carbide at low upper temperature and results from oxidation at high upper temperature. The thermal fatigue crack of the heat treated alloy is mainly initiated by the oxidized cavity and then propagates through the join of the oxidized cavity. The orientation of crack propagation and direction of dendrite growth of alloy have the angle of 45°. There is γ′ denuded region near the thermal fatigue crack because of oxidation.

Keywords

nickel-base superalloy / thermal fatigue / microstructure / crack

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Peng-Cheng XIA, Feng-Wen CHEN, Kun XIE, Ling QIAO, Jin-Jiang YU. Influence of microstructures on thermal fatigue property of a nickel-base superalloy. Front. Mater. Sci., 2015, 9(1): 85‒92 https://doi.org/10.1007/s11706-015-0277-9

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Acknowledgements

This work was financially supported by Research Award Fund for Outstanding Young and Middle-aged Scientists of Shandong Province in China (BS2011CL032), Taishan Scholars Project of Shandong (ts20110828), the State Key Laboratory of Mining Disaster Prevention and Control Co-founded by Shandong Province and the Ministry of Science and Technology, Shandong University of Science and Technology (MDPC2013KF15), and the National Natural Science Foundation of China (Grant Nos. 51272141 and 51208288). The authors are grateful for those supports.

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2014 Higher Education Press and Springer-Verlag Berlin Heidelberg
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