
Research on Au-Al bonding properties based on a thermal shock environment
ZHOU Jicheng1, YAN Qinyun1, JIANG Qinming1, YANG Dan2, HUANG Yun2
Front. Mater. Sci. ›› 2007, Vol. 1 ›› Issue (3) : 280-283.
Research on Au-Al bonding properties based on a thermal shock environment
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