Fabrication of an electronic package box of SiCP/Al composites with high volume SiCP

Abstract

In this paper, a SiC_P preform was prepared by Powder Injection Molding (PIM), and the melting aluminum was injected into the SiC_P preform by the pressure infiltration method to manufacture an electronic package box of SiC_P (65%)/Al composites. SiC_P (65%)/Al composite prepared by pressure infiltration has full density and a homogeneous microstructure. The relative density of the composite is higher than 99%, the thermal expansion coefficient and thermal conductivity of the composite are 8.0?10 ^6/K and nearly 130 W/(m °K) at room temperature, respectively, which meet the requirements of electronic packaging.