Phase change effect of low melting point metal for an automatic cooling of USB flash memory

Haoshan GE, Jing LIU

PDF(129 KB)
PDF(129 KB)
Front. Energy ›› 2012, Vol. 6 ›› Issue (3) : 207-209. DOI: 10.1007/s11708-012-0204-z
SHORT COMMUNICATION
SHORT COMMUNICATION

Phase change effect of low melting point metal for an automatic cooling of USB flash memory

Author information +
History +

Cite this article

Download citation ▾
Haoshan GE, Jing LIU. Phase change effect of low melting point metal for an automatic cooling of USB flash memory. Front Energ, 2012, 6(3): 207‒209 https://doi.org/10.1007/s11708-012-0204-z

References

[1]
Chowdhury I, Prasher R, Lofgreen K, Chrysler G, Narasimhan S, Mahajan R, Koester D, Alley R, Venkatasubramanian R. On-chip cooling by superlattice-based thin-film thermoelectrics. Nature Nanotechnology, 2009, 4(4): 235–238
CrossRef Pubmed Google scholar
[2]
Prada L, Garcia J D, Carretero J. Garcia F. Saving power in flash and disk hybrid storage system. In: 2009 IEEE International Symposium on Modeling, Analysis & Simulation of Computer and Telecommunication Systems, Arlington, Virginia, USA, 2009, 632–634
[3]
Leo H L, Sinclair G B. Flash temperature distributions at the head-disk interface in hard disk drives. ASME Journal of Tribology, 1998, 120(3): 536–541
CrossRef Google scholar
[4]
Liu J, Zhou Y. Chip cooling device using low melting point metals or their alloys as the flow of refrigerant. China Patent, CN02131419.5. 2004
[5]
Ma K, Liu J. Liquid metal cooling in thermal management of computer chips. Frontiers of Energy and Power Engineering, 2007, 1(4): 384–402
CrossRef Google scholar
[6]
Li P, Liu J. Harvesting low grade heat to generate electricity with thermosyphon effect of room temperature liquid metal. Applied Physics Letters, 2011, 99(9): 094106
CrossRef Google scholar
[7]
Dai D, Zhou Y, Liu J. Liquid metal based thermoelectric generation system for waste heat recovery. Renewable Energy, 2011, 36(12): 3530–3536
CrossRef Google scholar
[8]
Deng Y, Liu J. A liquid metal cooling system for the thermal management of high power LEDs. International Communications in Heat and Mass Transfer, 2010, 37(7): 788–791
CrossRef Google scholar
[9]
Li H, Liu J. Revolutionizing heat transport enhancement with liquid metals: Proposal of a new industry of water-free heat exchangers. Frontiers in Energy, 2011, 5(1): 20–42
CrossRef Google scholar
[10]
Lv Y, Liu J. Interpretation on thermal comfort mechanisms of human bodies by combining Hodgkin-Huxley neuron model and Pennes bioheat equation. Forschung im Ingenieurwesen, 2005, 69(2): 101–114
CrossRef Google scholar
[11]
Kandasamy R, Wang X Q, Mujumdar A S. Application of phase change materials in thermal management of electronics. Applied Thermal Engineering, 2007, 27(17,18): 2822–2832
[12]
Shen W J, Tan F L. Thermal management of mobile devices. Thermal Science, 2010, 14(1): 115–124
CrossRef Google scholar

RIGHTS & PERMISSIONS

2014 Higher Education Press and Springer-Verlag Berlin Heidelberg
AI Summary AI Mindmap
PDF(129 KB)

Accesses

Citations

Detail

Sections
Recommended

/