Synthesis of a Novel Silicon-containing Epoxy Compound and Its Mechanical Properties for Amine Curing

Yafen Qu , Yanling Yu , Biwu Huang

Journal of Wuhan University of Technology Materials Science Edition ›› 2025, Vol. 40 ›› Issue (4) : 1169 -1175.

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Journal of Wuhan University of Technology Materials Science Edition ›› 2025, Vol. 40 ›› Issue (4) : 1169 -1175. DOI: 10.1007/s11595-025-3154-0
Organic Materials
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Synthesis of a Novel Silicon-containing Epoxy Compound and Its Mechanical Properties for Amine Curing

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Abstract

[2-(3,4-epoxy-cyclohexyl)ethyl]dimethyltert-butylsilane was synthesized, using tert-butyldimethylsilane (TBDMS) and 1,2-epoxy-4-vinylcyclohexane (EVC) as the main raw materials and tris(triphenylphosphine) chlororhodium(I) [RhCl(Ph3P)3] as the catalyst. [2-(3,4-epoxy-cyclohexyl)ethyl] dimethyltert-butylsilane is a novel kind of silicon-containing epoxide. The factors affecting the reaction yield, such as catalyst use, reaction time and reaction temperature, were investigated, and the synthesized product was characterized and analyzed by FT-IR and 1H-NMR. A series of amine-curing resins were prepared with [2-(3,4-epoxy-cyclohexyl)ethyl]dimethyltert-butylsilane, bisphenol A epoxy resin (E-51) and modified amine (593 amine). The mechanical properties of cured splines with the different proportions of amine-curing resins were tested. When the content of 593 amine was 20%, the content of E-51 was 75% and the amount of [2-(3,4-epoxy-cyclohexyl) ethyl] dimethyltert-butylsilane was 5%, the mechanical properties of the cured splines were the best with the tensile strength being 23.3 MPa, the elongation at break being 7.8%, and the Young’s modulus being 421.3 MPa.

Keywords

epoxide resin / silicone / amine curing / diluents / mechanical properties

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Yafen Qu, Yanling Yu, Biwu Huang. Synthesis of a Novel Silicon-containing Epoxy Compound and Its Mechanical Properties for Amine Curing. Journal of Wuhan University of Technology Materials Science Edition, 2025, 40(4): 1169-1175 DOI:10.1007/s11595-025-3154-0

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Wuhan University of Technology and Springer-Verlag GmbH Germany, Part of Springer Nature

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