Surface Metallization of Glass Fiber (GF) / Polyetheretherketone (PEEK) Composite with Cu Coatings Deposited by Magnetron Sputtering and Electroplating

Abstract

Surface metallization of glass fiber (GF) / polyetheretherketone (PEEK)[GF/PEEK] is conducted by coating copper using electroplating and magnetron sputtering and the properties are determined by X-ray diffraction (XRD), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD). The coating bonding strength is assessed by pull-out tests and scribing in accordance with GB/T 9286-1998. The results show that the Cu coating with a thickness of 30 µm deposited on GF/PEEK by magnetron sputtering has lower roughness, finer grain size, higher crystallinity, as well as better macroscopic compressive stress, bonding strength, and electrical conductivity than the Cu coating deposited by electroplating.

Keywords

surface metallization / Cu coating / magnetron sputtering / electroplating

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