Investigation of Microstructure, Microhardness and Thermal Properties of Ag-In Intermetallic Alloys Prepared by Vacuum Arc Meltings

Erçevik Çelık , Pınar Ata Esener , Esra Öztürk , Sezen Aksöz

Journal of Wuhan University of Technology Materials Science Edition ›› 2024, Vol. 39 ›› Issue (1) : 182 -187.

PDF
Journal of Wuhan University of Technology Materials Science Edition ›› 2024, Vol. 39 ›› Issue (1) : 182 -187. DOI: 10.1007/s11595-024-2870-1
Metallic Materials

Investigation of Microstructure, Microhardness and Thermal Properties of Ag-In Intermetallic Alloys Prepared by Vacuum Arc Meltings

Author information +
History +
PDF

Abstract

Ag-In intermetallic alloys were produced by using vacuum arc furnace. Differential Scanning Calorimetry (DSC) and Energy Dispersive X-Ray Spectrometry (EDX) were used to determine the thermal properties and chemical composition of the phases respectively. Microhardness values of Ag-In intermetallics were calculated with Vickers hardness measurement method. According to the experimental results, Ag-34 wt%In intermetallic system generated the best results of energy saving and storage compared to other intermetallic systems. Also from the microhardness results, it was observed that intermetallic alloys were harder than pure silver and Ag-26 wt% In system had the highest microhardness value with 143.45 kg/mm2.

Keywords

thermal properties / microstructure characterization / microhardness / alloys / material characterization

Cite this article

Download citation ▾
Erçevik Çelık, Pınar Ata Esener, Esra Öztürk, Sezen Aksöz. Investigation of Microstructure, Microhardness and Thermal Properties of Ag-In Intermetallic Alloys Prepared by Vacuum Arc Meltings. Journal of Wuhan University of Technology Materials Science Edition, 2024, 39(1): 182-187 DOI:10.1007/s11595-024-2870-1

登录浏览全文

4963

注册一个新账户 忘记密码

References

[1]

Callıster WD, Rethwısch DG. Materials Science and Engineering, 2011 8th. Ed New Jersy: Willey.

[2]

Reed TB. Arc Techniques for Materials Research[J]. Mater. Res. Bull., 1967, 2(3): 349-367.

[3]

Lee CC, Ww S. High Temperature Silver-indium Joints Manufactured at Low Temperature[J]. Thin Solid Films, 2000, 366: 196-201.

[4]

Chuang RW, Lee CC. Silver-Indium Joints Produced at Low Temperature for High Temperature Devices[J]. IEEE Transactions on Components and Packaging Technologies, 2002, 25(3): 453-458.

[5]

Ferro R, Saccone A. Intermetallic Chemistry, Pergamon Materials Science, 2008 Amsterdam: Elsevier.

[6]

Fahim A, Ahmed S, Suhling JC, et al. Mechanical Characterization of Intermetallic Compounds in SAC Solder Joints at Elevated Temperatures[C]. 17th IEEE ITHERM Conference, 2018

[7]

Baren MR. ASM Handbook Volume 3 Alloy Phase Diagrams, 1992 Ohio: ASM Int. Alloy Phase Diagram and the Handbook Committees.

[8]

Simic V, Marinkovic Z. Room Temperature Interactions in Ag-metals Thin Films Couples[J]. Thin Solid Films, 1979, 61: 149-160.

[9]

Roy R, Sen SK. The Kinetics of Formation of Intermetallics in Ag/In Thin Film Couples[J]. Thin Solid Films, 1992, 197: 303-318.

[10]

Pöttgen R, Gulden T, Simon A. Miniaturisierte Lichtbogenapparatur für den Laborbedarf[J]. GIT Labor-Fachzeitschrift, 1999, 43: 133-136.

[11]

Çelik E. The Investigation of Thermal, Microstructure and Mechanical Properties of Ag-In Intermetallic Phases[D], 2019 Nevşehir: Nevşehir Haci Bektaş, Veli University.

[12]

Baker H. Metals Handbook: Properties and Selection: Nonferrous Alloys and Pure Metals, 1979 9 th. Ed Ohio: American Society for Metals.

[13]

Ata P. The Determination of Thermal Temperature Coefficients with Linear Heat Flow Apparatus of In-Bi İntermetallic Alloys[M], 2015 Nevşehir: Nevşehir Haci Bektaş, Veli University.

[14]

Kim YS, Kim KS, Hwang CW, et al. Effect of Composition and Cooling Rate on Microstructure and Tensile Properties of Sn-Zn-Bi Alloys[J]. J. Alloys Compd., 2003, 352: 237-245.

[15]

Notis MR, Brown J, Cotell CM, et al. ASM Hand Book, 1992 Ohio: ASM Iternational.

[16]

El-Bahay MM, El Mossalamy ME, Mahdy M, et al. Some Mechanical Properties of Sn-3.5Ag Eutectic Alloy at Different Temperatures[J]. Journal of Materials Science: Materials in Electronics, 2004, 15: 519-526.

AI Summary AI Mindmap
PDF

151

Accesses

0

Citation

Detail

Sections
Recommended

AI思维导图

/