The printing and firing process of A1 paste in PTC ohmic contact electrodes

Liang Fei , Zhou Dong-xiang , LV Wen-zhong , Gong Shu-ping

Journal of Wuhan University of Technology Materials Science Edition ›› 2004, Vol. 19 ›› Issue (3) : 26 -28.

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Journal of Wuhan University of Technology Materials Science Edition ›› 2004, Vol. 19 ›› Issue (3) : 26 -28. DOI: 10.1007/BF02835053
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The printing and firing process of A1 paste in PTC ohmic contact electrodes

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Abstract

Al electrodes are well known as ohmic contact electrodes for the PTC component, the influence of their thickness on final component properties was investigated by comparing their ohmic characteristics with the ones of InGa electrodes. After observing the Al paste physical and chemical behaviors during rising temperature by thermal analysis (DTA), the firing operation of Al electrodes could be divided into three main subsections: the temperature rising time (tr), the peak firing temperature (Tp) and the hold time at peak firing temperature (th). The effects of these three parameters on final component properties were discussed in detail.

Keywords

PTC thermistor / Al electrodes / ohmic contact characteristics / printing and firing process

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Liang Fei, Zhou Dong-xiang, LV Wen-zhong, Gong Shu-ping. The printing and firing process of A1 paste in PTC ohmic contact electrodes. Journal of Wuhan University of Technology Materials Science Edition, 2004, 19(3): 26-28 DOI:10.1007/BF02835053

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References

[1]

Yamei Yao. Study on Print and Fire Process of Ag Paste in PTC Ohm Electrodes. Mixed Microelectronic Technology, 1993, 7(4): 49-54.

[2]

Heinenb Waser R. Influence of the Thickness and Area of NiCr/Ag Electrodes on the Characteristics of BaTiO3-ceramic Basic Positive-temperature-coefficient Thermistors. Journal of Materials Science, 1998, 33: 603-4608.

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Ling Zhao, Fuling Tang. The Ohm Contact Silver Paste for the Use of PTC Thermistor. Precious Metal, 1998, 19(1): 9-13.

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Wentong Sun. Conduction Mechanism of Electronic Thick Layer Material of Base Metal. Electronic Component and Material, 1997, 16: 314-319.

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