Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn−9Zn solder alloy and interfacial properties of Cu/solder/Cu joints

Abstract

Rapidly solidified Sn-9Zn-0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd (mass fraction) addition on the microstructure, thermodynamic characteristic of Sn-9Zn solder alloy were analyzed. The tensile-shear tests were used to evaluate the mechanical properties of solder/Cu joints. The results show that the rapid solidification process can greatly refine the microstructure of Sn-9Zn-0.1Pr(/Nd) alloys. After rapid solidification, the effects of Pr/Nd addition on microstructure are depressed. The pasty range of the rapidly solidified Sn-Zn-RE solders is also reduced significantly. The mechanical properties of solder/Cu joints are obviously improved using the rapidly solidified Sn-9Zn-0.1Pr(/Nd) solder alloy, which results in the formation of uniform interface. The promotion effect of Nd addition in Sn-9Zn alloy on the interfacial reaction of solder/Cu joint is more remarkable than that of Pr.

Keywords

rapid solidification / Sn−Zn−RE solder / microstructure / interfacial property

References

[1] MaH, SuhlingJ C. A review of mechanical properties of lead-free solders for electronic packaging [J].. Journal of Materials Science, 2009, 44(5): 1141-1158

[2] LiuS, XueS B, XueP, LuoD X. Present status of Sn-Zn lead-free solders bearing alloying elements [J].. Journal of Materials Science: Materials in Electronics, 2015, 26(7): 4389-4411

[3] ZhangL, XueS B, GaoL L, ShengZ, YeH, XiaoZ X, ZengG, ChenY, YuS L. Development of Sn-Zn lead-free solders bearing alloying elements [J].. Journal of Materials Science: Materials in Electronics, 2010, 21(1): 1-15

[4] SuganumaK, KimK S. Sn-Zn low temperature solder [J].. Journal of Materials Science: Materials in Electronics, 2007, 18(1-3): 121-127

[5] HuY H, XueS B, YeH, XiaoZ X, GaoL L, ZengG. Reliability studies of Sn-9Zn/Cu and Sn-9Zn-0.06 Nd/Cu joints with aging treatment [J].. Materials & Design, 2012, 34: 768-775

[6] XueP, XueS B, ShenY F, ZhuH, GaoL L. Investigation on the intermetallic compound layer growth of SnZnGa/SnZnGaNd solder joints [J].. Journal of Materials Science: Materials in Electronics, 2014, 25(10): 1-6

[7] LaverniaE J, SrivatsanT S. The rapid solidification processing of materials: Science, principles, technology, advances, and applications [J].. Journal of Materials Science, 2010, 45(2): 287-325

[8] ShalabyR M. Effect of rapid solidification on mechanical properties of a lead free Sn-3.5Ag solder [J].. Journal of Alloys and Compounds, 2010, 505: 113-117

[9] ShepelevichV G, GusakovaO V. Structure and properties of rapidly solidified Sn-Zn foils [J].. Inorganic Materials, 2008, 44: 485-489

[10] GusakovaO V, ShepelevichV G. Structure and properties of rapidly solidified foils of alloys of Sn-Zn-Bi system [J].. Inorganic Materials Applied Research, 2010, 1: 344-349

[11] GB 11363—2008.Test method of the strength for brazed and soldered joint (National standard of the People Republic of China) [S], 2008

[12] ZhaoG J, ShengG M, LuoJ, YuanX J. Solder characteristics of a rapidly solidified Sn-9Zn-0.1Cr alloy and mechanical properties of Cu/Solder/Cu joints [J].. Journal of Electronic Materials, 2012, 41(8): 2100-2106

[13] ZhaoG J, ShengG M, XueH F, YuanX J. Improved mechanical property of a Cu/Sn-9Zn-0.1Cr/Cu joint using a rapidly solidified solder [J].. Materials Letters, 2012, 68(2): 129-132

[14] GarciaL R, OsorioW R, PeixotoL C, GarciaA. Mechanical properties of Sn-Zn lead-free solder alloys based on the microstructure array [J].. Materials Characterization, 2010, 61(2): 212-220

[15] JingY X, ShengG M, ZhaoG J. Influence of rapid solidification on microstructure, thermodynamic characteristic and the mechanical properties of solder/Cu joints of Sn-9Zn alloy [J].. Materials & Design, 2013, 52(24): 92-97

[16] HuZ-q, SongQ-h, ZhangH-f, LiuZhengMetastable metal materials [M], 20067-8

[17] HuY, XueS, WangH, YeH, XiaoZ, GaoL. Effects of rare earth element Nd on the solderability and microstructure of Sn-Zn lead-free solder [J].. Journal of Materials Science: Materials in Electronics, 2011, 22(5): 481-487

[18] XiaoZ, XueS, HuY, YeH, GaoL, WangH. Properties and microstructure of Sn-9Zn lead-free solder alloy bearing Pr [J].. Journal of Materials Science: Materials in Electronics, 2011, 22(6): 659-665