Application of response surface method for optimal transfer conditions of multi-layer ceramic capacitor alignment system

Abstract

The multi-layer ceramic capacitor (MLCC) alignment system aims at the inter-process automation between the first and the second plastic processes. As a result of testing performance verification of MLCC alignment system, the average alignment rates are 95% for 3216 chip, 88.5% for 2012 chip and 90.8% for 3818 chip. The MLCC alignment system can be accepted for practical use because the average manual alignment is just 80%. In other words, the developed MLCC alignment system has been upgraded to a great extent, compared with manual alignment. Based on the successfully developed MLCC alignment system, the optimal transfer conditions have been explored by using RSM. The simulations using ADAMS® has been performed according to the cube model of CCD. By using MiniTAB®, the model of response surface has been established based on the simulation results. The optimal conditions resulted from the response optimization tool of MiniTAB® has been verified by being assigned to the prototype of MLCC alignment system.

Keywords

multi-layer ceramic capacitor (MLCC) / alignment system / response surface method (RSM) / MiniTAB® / ADAMS®