Bonding strength in carbon steel sandwich panels under condition of diffusion-rolling with small reduction

Abstract

One of the key problems by diffusion-rolling bonding with small reduction for carbon steel plates is the bonding assistant coat. A bonding assistant coat used below 850 °C was developed. It contained copper as basic element and zinc as main alloy element. Other small elements and rare metals were added to decrease the melting point and to obtain a better clouding and high plasticity. Based on the theory of brazing and transient liquid diffusion welding, two carbon steel plates were rolled with small reduction by using self-made bonding assistant coat. Temperature, pressure and holding time are the main technology parameters for controlling the process of diffusion-rolling. The results show that the bonding strength is the greatest when the bonding temperature is 830 °C, holding time is 3 min and the reduction rate is 9%.

Keywords

bonding assistant coat / diffusion-rolling / steel sandwich panels / bonding strength

References

[1] ZouMo-lian. Transient liquid phase diffusion welding [J]. Aviation Precision Manufacturing Technology, 1993, 29(4): 22-24(in Chinese)

[2] SukM J, KwonY S, KimJ S, et al.. Transient liquid phase bonding process using liquid phase sintered alloys as an interlayer material[J]. Journal of Materials Science, 2002, 35(8): 1917-1919

[3] QuWen-qin, ZhangYan-hua. Advancement of TLP bonding technology[J]. Welding Technology, 2002, 31(3): 4-7(in Chinese)

[4] LiZhi-yuan, QianYi-yu, ZhangJiu-haiAdvanced Joining Method[M], 2000, Beijing, Mechanical Industry Press(in Chinese)

[5] ZhaoXi-huaPressure Welding[M], 2001, Beijing, Mechanical Industry Press(in Chinese)

[6] FuDing-meiResearch and Development of a New Bonding Assistant Coat Used in Steel Honeycomb Sandwich Panels[D], 2004, Beijing, University of Science and Technology Beijing(in Chinese)

[7] MENG Qing-lian. A Bonding Assistant Coat Used for Metal[P]. China: 94108027.7, 1994-08-04. (in Chinese)

[8] ZENG Qiu-lian, ZHANG Ai-sheng, WEI Xiu-qin. Effects of trace RE and B on copper and its alloy[J]. Special Casting and Nonferrous Alloy, 2002, (3): 55–57. (in Chinese)

[9] WanQun, LuHong. Application of RE in phosphor copper brazing filler metal[J]. Jiangxi Metallurgy, 2002, 22(6): 18-20(in Chinese)

[10] HuDe-lin, ZhangFanTernary Phase Diagram [M], 1995, Xi’an, Northwestern Polytechnical University Press(in Chinese)

[11] LiuS, OlsenD L, MartinG P, et al.. Modeling of brazing processes that use coating and interlayer[J]. Welding Journal, 1991, 70(8): 207-215

[12] ZhangGui-feng, ZhangJian-xun, WangShi-yuan. Similarities and differents in main characteristics between transient liquid phase bonding and brazing process[J]. Transactions of the China Welding Institution, 2002, 23(6): 92-97(in Chinese)

[13] Tuah-PokuI, DollarM, MassalskiT B. A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint[J]. Metallurgical Transactions A, 1988, 19A(3): 675-686

[14] YuJiu-ming, FangXiao-ying, XiaoYun-zhen. Liquid and solid bonding strength of Cu/Fe interface in copper clad steel[J]. Chinese Journal of Materials Research, 2000, 14(6): 661-664(in Chinese)

[15] ZouXiBrazing[M], 1995, Beijing, Mechanical Industry Press(in Chinese)