Thermal stress in SiC element used in heat exchanger

He-song Li , Chi Mei

Journal of Central South University ›› 2005, Vol. 12 ›› Issue (6) : 709 -713.

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Journal of Central South University ›› 2005, Vol. 12 ›› Issue (6) : 709 -713. DOI: 10.1007/s11771-005-0074-1
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Thermal stress in SiC element used in heat exchanger

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Abstract

An especial snake SiC pipe was designed for collecting losing heat from furnaces. The three-dimensions thermal, fluid and thermal stress coupled field of heat exchanger was analyzed by using the commercial engineering computer package ANSYS. The structural and operational parameters of heat exchanger, the junction between standpipe and snake pipe, the diameter of snake pipe, ratio of thickness to diameter of pipe, velocity of inlet air were optimized for thermal stress. The computed results show that the large thermal stress exits in the SiC, and the stand pipe should be ellipse for the least thermal stress; the optimal ratio of thickness to diameter of pipe is 6, the velocity of inlet air is 25 m/s. The most thermal stress is in inverse proportion to diameter of pipe and velocity of inlet air.

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finite element method / simulation / heat exchanger element / thermal stress

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He-song Li,Chi Mei. Thermal stress in SiC element used in heat exchanger. Journal of Central South University, 2005, 12(6): 709-713 DOI:10.1007/s11771-005-0074-1

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