Advances and Challenges in Functional Abrasive Design for Chemical Mechanical Polishing of Semiconductors and in Optical Manufacturing

Abstract

The ever-growing demand for ultraprecision in semiconductor and optical manufacturing hinges critically on advances in chemical mechanical polishing (CMP), where the effectiveness of abrasive particles is paramount. Achieving the elusive combination of high material removal rates and atomically smooth, defect-free surfaces remains a fundamental challenge. This review provides a comprehensive assessment of advanced abrasive materials, highlighting the roles of CeO₂, SiO₂, and Al₂O₃, together with emerging nanomaterials such as nanodiamonds, in enabling efficient CMP of hard and brittle substrates. This work also presents a critical analysis of their structure-property-performance relationships, focusing on their mechanistic roles in polishing hard-to-process materials like SiC and sapphire. Furthermore, the review highlights cutting-edge advances in abrasive design, surface chemistry modulation, and the integration of intelligent CMP systems. Finally, current challenges and future directions are delineated, providing a roadmap for the rational design of next-generation, sustainable abrasive systems to meet the escalating demands of precision manufacturing.

Keywords

chemical mechanical polishing / functional abrasives / surface quality optimization / sustainable materials design / synergistic removal mechanism

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