Coplanarity Index for Potential Slip Systems Predicting in Plastic Semiconductors
Xingyan Dong , Yongqiang Yan , Zihang Liu , Yu-Ke Zhu , Jianbo Zhu , Lankun Wang , Jinsuo Hu , Kuai Yu , Muchun Guo , Ming Liu , Fengkai Guo , Ge Wu , Wei Cai , Zhi-Wei Shan , Jiehe Sui
Interdisciplinary Materials ›› 2026, Vol. 5 ›› Issue (1) : 192 -200.
Despite growing interest in room-temperature plastic semiconductors, understanding and predicting slip modes in semiconductors remains a fundamental challenge due to their complex, low-symmetry structures. Applying analytical frameworks of metal plasticity to semiconductors directly can lead to the ignorance of the quasi-coplanarity in semiconductors due to their complex structures. In this work, we introduce a geometric-descriptor guided strategy to identify potential operative slip systems in semiconductors. A coplanarity index (CI) is developed to quantitatively characterize the quasi-aligned nature of atomic planes. The applicability of the CI is demonstrated in high-performance plastic thermoelectric material Mg3Sb2. A quasi-aligned pyramidal plane with high CI value in hexagonal Mg3Sb2 is predicted to be the active slip plane for 〈c + a〉 dislocation slip, accommodating plastic deformation along the c-axis, which is a mechanism that has not been previously recognized in hexagonal semiconductors. The CI values of the planes also reflect the differences in the atom configurations among the isostructure AB2X2 Zintl phases, which indicates the good plasticity of Mg3Sb2 from the perspective of coplanarity. This geometry-energy integrated framework offers a quantitative methodology for understanding and designing ductile functional semiconductors.
coplanarity index / geometric descriptor / plastic semiconductor / slip system prediction
| [1] |
|
| [2] |
|
| [3] |
|
| [4] |
|
| [5] |
|
| [6] |
|
| [7] |
|
| [8] |
|
| [9] |
|
| [10] |
|
| [11] |
|
| [12] |
|
| [13] |
|
| [14] |
|
| [15] |
|
| [16] |
|
| [17] |
|
| [18] |
|
| [19] |
|
| [20] |
|
| [21] |
|
| [22] |
|
| [23] |
|
| [24] |
|
| [25] |
|
| [26] |
|
| [27] |
|
| [28] |
|
| [29] |
|
| [30] |
|
| [31] |
|
| [32] |
|
| [33] |
|
2026 The Author(s). Interdisciplinary Materials published by Wuhan University of Technology and John Wiley & Sons Australia, Ltd.
/
| 〈 |
|
〉 |