Superior through-plane thermal conductivity in carbon fibers/spherical graphene/epoxy laminated composites for low-altitude aircrafts
Shengyuan Gao , Hua Guo , Yongqiang Guo , Hua Qiu , Wei Gong , Junwei Gu
InfoMat ›› 2026, Vol. 8 ›› Issue (6) : e70139
The rapid expansion of the low-altitude economy has driven growing demand for carbon fiber/epoxy composites in applications including unmanned aerial vehicles and electric vertical take-off and landing aircraft. However, the characteristically low through-plane thermal conductivity (λ⊥) of these composites poses a critical thermal conduction limitation, which adversely affects the performance and reliability of onboard electronic systems. In this work, we present an architectural design to improve the λ⊥ of mesophase pitch-based carbon fiber (MPCF)/epoxy composites by incorporating precisely engineered spherical thermally reduced graphene (s-TRG) as a bridging filler. At a loading of 10 wt% s-TRG and 60 wt% MPCF, the MPCF/s-TRG/epoxy composite achieves a λ⊥ of 2.73 W m–1 K–1, representing a 173.0% improvement over the MPCF/epoxy composite (1.00 W m–1 K–1) and about 1.71 times the λ⊥ of its conventional TRG-filled analogue (1.60 W m–1 K–1). Monte Carlo simulations reveal that the enhancement originates from the isotropic spherical architecture of s-TRG, which facilitates efficient multi-point bridging within the three-dimensional interlaminar space, thereby overcoming the limited through-plane contact characteristic of planar graphene sheets. This work not only provides an efficient filler structural design strategy for thermal enhancement but also suggests a feasible route toward managing heat in high power density electronics for next-generation lightweight low-altitude aircraft.
carbon fiber / epoxy resin / spherical thermally reduced graphene / through-plane thermal conductivity
| [1] |
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| [2] |
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| [3] |
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| [4] |
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| [5] |
|
| [6] |
|
| [7] |
|
| [8] |
|
| [9] |
|
| [10] |
|
| [11] |
|
| [12] |
|
| [13] |
|
| [14] |
|
| [15] |
|
| [16] |
|
| [17] |
|
| [18] |
|
| [19] |
|
| [20] |
|
| [21] |
|
| [22] |
|
| [23] |
|
| [24] |
|
| [25] |
|
| [26] |
|
| [27] |
|
| [28] |
|
| [29] |
|
| [30] |
|
| [31] |
|
| [32] |
|
| [33] |
|
| [34] |
|
| [35] |
|
| [36] |
|
| [37] |
|
| [38] |
|
| [39] |
|
| [40] |
|
| [41] |
|
| [42] |
|
| [43] |
|
| [44] |
|
| [45] |
|
| [46] |
|
| [47] |
|
| [48] |
|
| [49] |
|
| [50] |
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2026 The Author(s). InfoMat published by UESTC and John Wiley & Sons Australia, Ltd.
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