The miniaturization of imaging systems is essential for modern optoelectronics, while traditional bulk optics fundamentally limit integration density. Metasurfaces offer a transformative planar alternative by providing nanoscale control over incident light. However, realizing their full potential requires transitioning from discrete optical components to fully integrated sensing architectures. This review surveys the progressive integration of metasurface with photodetectors and image sensors. We examine the developmental trajectory across three distinct levels: free-space optical path placement, hybrid adhesive mounting and direct monolithic fabrication. Particular emphasis is placed on monolithic architectures and their role in enabling multi-dimensional information extraction. Finally, we discuss emerging challenges in material compatibility and scalable manufacturing to provide clear directions for future ultracompact optoelectronic device development.