Liquid metal cooling in thermal management of computer chips

Front. Energy ›› 2007, Vol. 1 ›› Issue (4) : 384 -402.

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Front. Energy ›› 2007, Vol. 1 ›› Issue (4) : 384 -402. DOI: 10.1007/s11708-007-0057-3

Liquid metal cooling in thermal management of computer chips

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Abstract

With the rapid improvement of computer performance, tremendous heat generation in the chip becomes a major serious concern for thermal management. Meanwhile, CPU chips are becoming smaller and smaller with almost no room for the he

Keywords

chip cooling, liquid metal, liquid cooling, gallium and alloy, thermal management, convective cooling, high heat flux density, heat transfer enhancement

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null. Liquid metal cooling in thermal management of computer chips. Front. Energy, 2007, 1(4): 384-402 DOI:10.1007/s11708-007-0057-3

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