Liquid metal cooling in thermal management of computer chips

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This article has been updated. A Correction to this article was published on .

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The Original Article was published on

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The Original Article was published on

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Abstract

With the rapid improvement of computer performance, tremendous heat generation in the chip becomes a major serious concern for thermal management. Meanwhile, CPU chips are becoming smaller and smaller with almost no room for the he

Keywords

chip cooling, liquid metal, liquid cooling, gallium and alloy, thermal management, convective cooling, high heat flux density, heat transfer enhancement

CHANGE HISTORY

A Correction to this paper has been published:
https://doi.org

The Retraction Note was updated to reflect reception of statements of disagreement from all authors.

This article has been retracted.Please see the Retraction Notice for more detail:
https://doi.org