Electrochemical study and electrodeposition of copper(I) in ionic liquid-reline

Abstract

The authors made the electrochemical studies on the electrode processes during copper electrodeposition with ionic liquids-reline as an electrolytic medium. Reline is a commercial name for a eutectic mixture of choline chloride and urea(1:2, molar ratio). This new proposed method of copper deposition is an ecological one because the ionic liquids are recyclable, non-volatile and non-toxic. Cyclic voltammetry investigations were conducted at 343 and 353 K in choline chloride-urea(Reline) deep eutectic solvent with single salt CuCl(generally in 0.05–0.38 mol/L concentration range). Electrochemical impedance spectroscopy investigations were conducted in choline chlorideurea ionic liquid with CuCl(0.05 mol/L). We investigated both cathodic and anodic processes of Cu⁺ ions at different sweep rates in this new electrolytic system based on choline chloride. We have proposed by this an alternative to the classical copper electrodeposition. Coefficient of diffusion, D ₀, for the system Reline-CuCl is presented and the value of D ₀ is 1.22×10⁻⁸ cm²/s.

Keywords

Ionic liquid / Reline / Electrodeposition / Cu(I) / Coefficient of diffusion

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