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Frontiers in Energy

Front Energ    2013, Vol. 7 Issue (4) : 479-486
Experimental investigation of liquid metal alloy based mini-channel heat exchanger for high power electronic devices
Manli LUO1, Jing LIU1,2()
1. Key Lab of Cryogenics and Beijing Key Lab of CryoBiomedical Engineering, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China; 2. Department of Biomedical Engineering, Tsinghua University, Beijing 100084, China
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There is currently a growing demand for developing efficient techniques for cooling integrated electronic devices with ever increasing heat generation power. To better tackle the high-density heat dissipation difficulty within the limited space, this paper is dedicated to clarify the heat transfer behaviors of the liquid metal flowing in mini-channel exchangers with different geometric configurations. A series of comparative experiments using liquid metal alloy Ga68%In20%Sn12% as coolant were conducted under prescribed mass flow rates in three kinds of heat exchangers with varied geometric sizes. Meanwhile, numerical simulations for the heat exchangers under the same working conditions were also performed which well interpreted the experimental measurements. The simulated heat sources were all cooled down by these three heat dissipation apparatuses and the exchanger with the smallest channel width was found to have the largest mean heat transfer coefficient at all conditions due to its much larger heat transfer area. Further, the present work has also developed a correlation equation for characterizing the Nusselt number depending on Peclet number, which is applicable to the low Peclet number case with constant heat flux in the hydrodynamically developed and thermally developing region in the rectangular channel. This study is expected to provide valuable reference for designing future liquid metal based mini-channel heat exchanger.

Keywords heat exchanger      liquid metal      mini-channel      heat dissipation      heat transfer coefficient     
Corresponding Author(s): LIU Jing,   
Issue Date: 05 December 2013
 Cite this article:   
Manli LUO,Jing LIU. Experimental investigation of liquid metal alloy based mini-channel heat exchanger for high power electronic devices[J]. Front Energ, 2013, 7(4): 479-486.
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Manli LUO
Jing LIU
1 Bergles A E. Evolution of cooling technology for electrical, electronic, and microelectronic equipment. IEEE Transactions on Components and Packaging Technologies , 2003, 26(1): 6–15
doi: 10.1109/TCAPT.2003.809664
2 Qu W L, Mudawar I, Lee S Y, Wereley S T. Experimental and computational investigation of flow development and pressure drop in a rectangular micro-channel. ASME Journal of Electronic Packaging , 2006, 128(1): 1–9
doi: 10.1115/1.2159002
3 Shah R K. Laminar flow friction and forced convection heat transfer in ducts of arbitrary geometry. International Journal of Heat and Mass Transfer , 1975, 18(7,8): 849–862
4 Muzychka Y S, Walsh E, Walsh P. Simple models for laminar thermally developing slug flow in noncircular ducts and channels. Journal of Heat Transfer , 2010, 132(11): 1–10
doi: 10.1115/1.4002095 pmid:20976021
5 Toh K C, Chen X Y, Chai J C. Numerical computation of fluid flow and heat transfer in microchannels. International Journal of Heat and Mass Transfer , 2002, 45(26): 5133–5141
doi: 10.1016/S0017-9310(02)00223-5
6 Talimi V, Muzychka Y S, Kocabiyik S. A review on numerical studies of slug flow hydrodynamics and heat transfer in microtubes and microchannels. International Journal of Multiphase Flow , 2012, 39: 88–104
doi: 10.1016/j.ijmultiphaseflow.2011.10.005
7 Dang T, Teng J. Influence of flow arrangement on the performance of an aluminium microchannel heat exchanger. IAENG Transactions on Engineering Technologies , 2010, 1285: 576–590
8 Arora R, Tonkvich A L, J Lamont M, Yuschak T, Silva L. Passive heat transfer enhancement in microchannel using wall features. In: Proceedings of International Conference on Nanochannels, Microchannels, Minichannels . Puebla, Mexico, 2007, 18–20
9 Khaled A R A, Vafai K. Cooling augmentation using microchannels with rotatable separating plates. International Journal of Heat and Mass Transfer , 2011, 54(15,16): 3732–3739
10 Lu C T, Pan C. Convective boiling in a parallel microchannel heat sink with a diverging cross section and artificial nucleation sites. Experimental Thermal and Fluid Science , 2011, 35(5): 810–815
doi: 10.1016/j.expthermflusci.2010.08.018
11 Lelea D, Nisulescu C. The micro-tube heat transfer and fluid flow of water based Al2O3 nanofluid with viscous dissipation. International Communications in Heat and Mass Transfer , 2011, 38(6): 704–710
doi: 10.1016/j.icheatmasstransfer.2011.04.002
12 Prasher R, Chang J Y. Cooling of electronic chips using microchannel and micro-fin heat exchangers. In: Proceedings of International Conference on Nanochannels, Microchannels, Minichannels . Darmstadt, Germany, 2008, 23–25
13 Khan M G, Fartaj A. A review on microchannel heat exchangers and potential applications. International Journal of Energy Research , 2011, 35(7): 553–582
doi: 10.1002/er.1720
14 Qu W L, Mudawar I.Measurement and correlation of critical heat flux in two-phase micro channel heat sinks. International Journal of Heat and Mass Transfer , 2004, 47(10,11): 2045–2059
15 Chen W L, Twu M C, Pan C. Gas-liquid two-phase flow in micro-channels. International Journal of Multiphase Flow , 2002, 28(7): 1235–1247
doi: 10.1016/S0301-9322(02)00023-X
16 Hwang J J, Tseng F G, Pan C. Ethanol- CO2 two-phase flow in diverging and converging microchannels. International Journal of Multiphase Flow , 2005, 31(5): 548–570
doi: 10.1016/j.ijmultiphaseflow.2005.01.011
17 Lee J, Mudawar I.Assessment of the effectiveness of nanofluids for single-phase and two-phase heat transfer in micro-channels. International Journal of Heat and Mass Transfer , 2007, 50(3,4): 452–463
18 Liu J, Zhou Y X. A computer chip cooling device using liquid metal with low melting point and its alloys as the cooling fluid. China Patent No.: 02131419 , 2002
19 Ma K Q, Liu J. Heat-driven liquid metal cooling device for the thermal management of a computer chip. Journal of Physics. D, Applied Physics , 2007, 40(15): 4722–4729
doi: 10.1088/0022-3727/40/15/055
20 Deng Y G, Liu J, Zhou Y X. Liquid metal based mini/micro channel cooling device. In: Proceedings of 7th International Conference on Nanochannels, Microchannels, Minichannels . Pohang, South Korea. 2009, 22–24
21 Miner A, Ghoshal U. Cooling of high-power-density microdevices using liquid metal coolants. Applied Physics Letters , 2004, 85(3): 506–508
doi: 10.1063/1.1772862
22 Ma K Q, Liu J, Xiang S H, Xie K W, Zhou Y X. Study of thawing behavior of liquid metal used as computer chip coolant. International Journal of Thermal Sciences , 2009, 48(5): 964–974
doi: 10.1016/j.ijthermalsci.2008.08.005
23 Deng Y G, Liu J. A liquid metal cooling system for the thermal management of high power LEDs. International Communications in Heat and Mass Transfer , 2010, 37(7): 788–791
doi: 10.1016/j.icheatmasstransfer.2010.04.011
24 Ma K Q, Liu J. Liquid metal cooling in thermal management of computer chips. Frontiers of Energy and Power Engineering in China , 2007, 1(4): 384–402
doi: 10.1007/s11708-007-0057-3
25 Ma L, Liu J, Ma K Q, Zhou Y X. Experimental study on liquid metal cooling for LED light. Journal of Optoelectronics·Laser , 2009, 20(9): 1150–1153
26 Tawk M, Avenas Y, Lebouc A, Petit M. Numerical study of a liquid metal mini-channel cooler for power semiconductor devices. In: 2011 17th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) . Paris, France, 2011, 1–6
27 Wilcoxon R, Lower N, Dlouhy D. A compliant thermal spreader with internal liquid metal cooling channels. In: Proceedings of 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium . Santa Clara, USA, 2010, 210–216
28 Deng Y G, Liu J. Corrosion development between liquid gallium and four typical metal substrates used in chip cooling device. Applied Physics. A, Materials Science & Processing , 2009, 95(3): 907–915
doi: 10.1007/s00339-009-5098-1
29 Shah R K, Kakac S, Aung W. Handbook of Single-Phase Convective Heat Transfer. Wiley , 1987
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