Unleashing high-flux evaporative cooling via 3D interconnected fiber membranes

Haosheng Lin , Fuxiang Li , Zengguang Sui , Wei Wu

Thermo-X ›› 2026, Vol. 2 ›› Issue (2) : 202604

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Thermo-X ›› 2026, Vol. 2 ›› Issue (2) :202604 DOI: 10.70401/tx.2026.0015
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Unleashing high-flux evaporative cooling via 3D interconnected fiber membranes
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Haosheng Lin, Fuxiang Li, Zengguang Sui, Wei Wu. Unleashing high-flux evaporative cooling via 3D interconnected fiber membranes. Thermo-X, 2026, 2 (2) : 202604 DOI:10.70401/tx.2026.0015

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References

[1]

Li Y, Chen H, Xiao S, Alibakhshi MA, Lo CW, Lu MC, et al. Ultrafast diameter-dependent water evaporation from nanopores. ACS Nano. 2019; 13(3):3363-3372.

[2]

Xiao R, Maroo SC, Wang EN. Negative pressures in nanoporous membranes for thin film evaporation. Appl Phys Lett. 2013; 102(12):123103.

[3]

Sohel Murshed SM, Nieto de Castro CA. A critical review of traditional and emerging techniques and fluids for electronics cooling. Renew Sustain Energy Rev. 2017; 78:821-833.

[4]

Liu X, Yang J, Zou Q, Hu Y, Li P, Tan L, et al. Enhancing liquid-vapor phase-change heat transfer with micro/nano-structured surfaces. ACS Nano. 2025; 19(10):9513-9589.

[5]

Feng T, Pei Y, Zhang H, Asai B, Dong G, Joshi A, et al. High-flux and stable thin-film evaporation from fiber membranes with interconnected pores. Joule. 2025; 9(7):101975.

[6]

Wen R, Xu S, Lee YC, Yang R. Capillary-driven liquid film boiling heat transfer on hybrid mesh wicking structures. Nano Energy. 2018; 51:373-382.

[7]

Kwon H, Wu Q, Kong D, Hazra S, Jiang K, Narumanchi S, et al. Capillary-enhanced two-phase micro-cooler using copper-inverse-opal wick with silicon microchannel manifold for high-heat-flux cooling application. Int Commun Heat Mass Transf. 2024; 156:107592.

[8]

Zhang C, Palko JW, Barako MT, Asheghi M, Goodson KE. Design and optimization of well-ordered microporous copper structure for high heat flux cooling applications. Int J Heat Mass Transf. 2021; 173:121241.

[9]

Li P, Liu X, Zou Q, Zhang X, Yang R. Heat transfer incipience of capillary-driven liquid film boiling. Mater Today Phys. 2023; 38:101230.

[10]

Li F, Sui Y, Lin H, Sui Z, Lee K, Xie S, et al. Self-adaptive interfacial evaporation for high-efficiency photovoltaic panel cooling. Device. 2025; 3(2):100569.

[11]

Sui Z, Sui Y, Ding Z, Lin H, Li F, Yang R, et al. Membrane-encapsulated, moisture-desorptive passive cooling for high-performance, ultra-low-cost, and long-duration electronics thermal management. Device. 2023; 1(6):100121.

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