How to reduce the Al-texture in AlN films during film preparation

Ju-qian Yin , Xi-ming Chen , Bao-he Yang , Qian Zhang , Xiao-guo Wu

Optoelectronics Letters ›› 2012, Vol. 8 ›› Issue (5) : 356 -358.

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Optoelectronics Letters ›› 2012, Vol. 8 ›› Issue (5) : 356 -358. DOI: 10.1007/s11801-012-2274-x
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How to reduce the Al-texture in AlN films during film preparation

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Abstract

The preparation of aluminum nitrogen (AlN) film without Al texture is of great significance for the manufacture of high-performance surface acoustic wave (SAW) device. We research the process factors which bring Al into AlN film due to radio frequency (RF) magnetron sputtering system, and discuss how the process parameters influence the AlN thin film containing Al. In the research, it is found that the high sputtering power, the low deposition pressures and low partial pressure of Ar can lead to growing Al-texture during AlN thin film preparation, and the experiment also shows that filling the chamber with nitrogen gas can recrystallize a small amount of Al composition into AlN film during the annealing process in the high temperature environment.

Keywords

Radio Frequency / Surface Acoustic Wave / Apply Physic Letter / Bulk Acoustic Wave / Physica Status Solidus

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Ju-qian Yin, Xi-ming Chen, Bao-he Yang, Qian Zhang, Xiao-guo Wu. How to reduce the Al-texture in AlN films during film preparation. Optoelectronics Letters, 2012, 8(5): 356-358 DOI:10.1007/s11801-012-2274-x

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References

[1]

OmarE., SergeiZ., Le LaurentB., FredericS., DmitryT., AbdouD. M.. Applied Physics Letters, 2009, 95: 233503

[2]

JiH., YangB.-h., LiC.-p.. Journal of Optoelectronics Laser, 2010, 21: 1524

[3]

IriarteG. F., RodriguezJ. G., CalleF.. Microsystem Technologies-Micro- and Nanosystems-Information Storage and Processing Systems, 2011, 17: 381

[4]

MutsukuraN., ShinodaH.. Thin Solid Films, 2012, 520: 4237

[5]

TomischK., CimallaV., FoersterCh., FoersterC., RomanusH., AmbacherO., DontsovD.. Sensors and Actuators A-Physical, 2006, 32: 658

[6]

AkiyamaM., XuC.-N., NonakaK., ShobuK., WatanabeT.. Thin Solid Film, 1999, 315: 62

[7]

XuX.-h., WuH.-s., ZhangF.-q., JinZ.-h.. Rare Metal Materials and Engineering, 2006, 29: 394

[8]

XuX.-H., WuH.-S., ZhangC.-j., JinZ.-h.. Chinese Journal of Applied Chemistry, 2000, 17: 411

[9]

GuoY., ChenX.-m., YangB.-h., SunL.-j., WuX.-g.. Journal of Optoelectronics Laser, 2011, 22: 1807

[10]

LiL.-n., ChenX.-l., LiuC., SunJ., GengX.-h., ZhaoY.. Journal of Optoelectronics Laser, 2010, 21: 559

[11]

LiufuD., KaoK. C.. J. Vac. Sci. Technol. A, 1998, 16: 2360

[12]

DuboisM., MuraltP.. Applied Physics Letters, 1999, 74: 3032

[13]

Qu Xi-xin, Films Physics, Shanghai Science and Technology Press, 161 (1986). (in Chinese)

[14]

HuangC. L., TayK. W., WuL.. Solid-State Electronics, 2005, 49: 219

[15]

BakalovaS., SzekeresA., HuhnG., HavancsakK., GrigorescuS., SocolG., RistoscuC., MillailescuI. N.. Vacuum, 2009, 84: 155

[16]

Monteagudo-LermaL., NaranjoF. B., Gonzaacutelez-HerraacuteezM., FernaacutendezS.. Physica Status Solidi C, 2012, 9: 1074

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