Application of UV depth lithography in micro system technology

Abstract

This letter reports on new types of photo resists allowing UV-light exposure of thick layers. Optimized processes Cthat for the positive resist AZ 9260 and the negative resist Epon SU-8 have been developed enabling the fabrication of high aspect ratio metallic and polymer micro components. The high potential of this technology will be demonstrated on the basis of two examples, a variable reluctance micro motor with compensated attractive force and an optical microphone developed for application in electro-magnetic interference environments.

References

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