A robust method to measure residual stress in micro-structure

Abstract

An experimental investigation on the residual stress in porous silicon micro-structure by means of micro-Raman spectroscopy is presented. It is shown by detecting the Raman peak shifts on the surfaces and cross-sections of electrochemical etched porous silicon samples with different porosities that serious residual stresses distribute complicatedly within the whole porous silicon structure. It is proved that micro-Raman spectroscopy is an effective method for residual stress testing on the micro-structures applied in optoelectronics and microelectronics.

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