3-D profile measurement for complex micro-structures

Chun-guang Hu, Xiao-dong Hu, Lin-yan Xu, Tong Guo, Xiao-tang Hu

Optoelectronics Letters ›› 2005, Vol. 1 ›› Issue (3) : 205-208.

Optoelectronics Letters ›› 2005, Vol. 1 ›› Issue (3) : 205-208. DOI: 10.1007/BF03033844
Measurement · Inspection

3-D profile measurement for complex micro-structures

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Abstract

Micro-structures 3-D profile measurement is an important measurement content for research on micromachining and characterization of micro-dimension. In this paper, a new method involved 2-D structure template, which guides phase unwrapping, is proposed based on phase-shifting microscopic interferometry. It is fit not only for static measurement but also for dynamic measurement, especially for motion of MEMS devices. 3-D profile of active comb of micro-resonator is obtained by using the method. The theoretic precision in out-of-plane direction is better than 0.5 nm. The in-plane, theoretic precision in micro-structures is better than 0.5 μm. But at the edge of micro-structures, it is on the level of micrometer mainly caused by imprecise edge analysis. Finally, its disadvantages and the following development are discussed.

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Chun-guang Hu, Xiao-dong Hu, Lin-yan Xu, Tong Guo, Xiao-tang Hu. 3-D profile measurement for complex micro-structures. Optoelectronics Letters, 2005, 1(3): 205‒208 https://doi.org/10.1007/BF03033844

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