Rapid Solidification Behavior and Microstructural Evolution of Copper-based Alloys under Deep Undercooling Condition

Yafeng Han , Bohao Hao , Shuwei Qu , Hongfu Wang , Ruiqin Li , Wei Yao

Journal of Wuhan University of Technology Materials Science Edition ›› 2026, Vol. 41 ›› Issue (2) : 512 -522.

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Journal of Wuhan University of Technology Materials Science Edition ›› 2026, Vol. 41 ›› Issue (2) :512 -522. DOI: 10.1007/s11595-026-3270-5
Metallic Materials
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Rapid Solidification Behavior and Microstructural Evolution of Copper-based Alloys under Deep Undercooling Condition
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Abstract

A deep-undercooling rapid-solidification technique combining cyclic superheating and molten glass purification was employed to successfully prepare Cu60Ni40 and Cu65Ni35 alloys at various undercooling levels. Furthermore, through precise compositional regulation by adjusting the Cu content and introducing Co, the Cu60Ni35Co5 alloy was obtained. The morphological evolution of the solidification front and the variation in solidification rate with undercooling were systematically investigated. By combining metallographic analysis, the BCT model, electron backscatter diffraction (EBSD), and transmission electron microscopy (TEM), the microstructural evolution and grain refinement mechanisms of the undercooled alloys were revealed. This work aims to establish the intrinsic relationship among undercooling, solidification behavior, and microstructure, thereby provides both experimental and theoretical foundations for a deeper understanding of the deep undercooling solidification mechanism and microstructural control.

Keywords

undercooling / microstructure / grain refinement / solidification rate

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Yafeng Han, Bohao Hao, Shuwei Qu, Hongfu Wang, Ruiqin Li, Wei Yao. Rapid Solidification Behavior and Microstructural Evolution of Copper-based Alloys under Deep Undercooling Condition. Journal of Wuhan University of Technology Materials Science Edition, 2026, 41(2): 512-522 DOI:10.1007/s11595-026-3270-5

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